Display device, backlight module and field emission light source device thereof
A light source device and field emission technology, applied in the direction of lamp components, etc., can solve the problems of serious heat generation, poor thermal conductivity, and shortened service life of field emission lighting devices.
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[0038] One of the specific implementation methods is as follows:
[0039]Make metal grid lines on the light emitting area on the white glass first. The physical vapor deposition process (PVD) is used to make the entire metal film. The metals are preferably Ti, Cu, W, Mo, Ag, Al, Au, Pt, Cu, etc., the target purity is >99.99%, and the film thickness is 10-100nm. Coat a layer of positive photoresist for TFT LCD on the metal film with a thickness of 1.5-5um. Using photolithography process, only the metal grid line pattern (pattern) in the light-emitting area is retained. The width of the metal line is 2-20um, accounting for less than the area of the light-emitting area. More than 5%.
[0040] In addition to the method of using positive photoresist, it is also possible to coat a layer of negative photoresist on the white glass (positive photoresist can also be used, the precision is slightly worse than negative photoresist), and the film thickness is 1.5-5um. After a photolith...
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