Unlock instant, AI-driven research and patent intelligence for your innovation.

Micromechanical acoustic transducer device and corresponding manufacturing method

An acoustic converter and micro-mechanical technology, applied in the direction of electrostatic transducer microphones, sensors, electrical components, etc., can solve the problem of MEMS microphones becoming smaller, and achieve the effects of low current consumption, large deflection, and high sensitivity

Active Publication Date: 2020-12-01
ROBERT BOSCH GMBH
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore capacitive MEMS microphones cannot be made smaller without performance loss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micromechanical acoustic transducer device and corresponding manufacturing method
  • Micromechanical acoustic transducer device and corresponding manufacturing method
  • Micromechanical acoustic transducer device and corresponding manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In the figures, identical reference signs indicate identical or functionally identical elements.

[0033] Figure 1a )-c) shows a schematic diagram of a micromechanical acoustic transducer device according to a first embodiment of the present invention, ie FIG. 1 ) is a first vertical sectional view, Figure 1b ) is the second vertical section along the line A-A', Figure 1c ) is a top view.

[0034] exist Figure 1a )-c), reference numeral 1 designates a substrate with a front side VS and a back side RS, which consists, for example, of a semiconductor material (eg silicon), glass or ceramic. The substrate 1 has a through-opening K, FZ extending between the rear side RS and the front side VS, said through-opening comprising a cavity K on the rear side and a through-hole FZ connected to the cavity. Such substrate geometries can be formed by known backside etching by means of corresponding etch stop layers.

[0035] An insulating layer I, for example made of oxide, is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a micromechanical sound transducer device and a corresponding manufacturing method. The micromechanical sound transducer device comprises a substrate and a coil device, wherein the substrate comprises a front side and a back side, and comprises a through opening extending between the back side and the front side; the coil device arranged on the front side has a coil axis which basically extends parallel to the front side, and the coil device spans the through opening at least partially; and the micromechanical sound transducer device is further provided with a magnet device, which is arranged in this way so that axial magnetic flux passing through the coil device can be generated by means of the magnet device. The coil device is provided with a winding device which at least comprises first winding sections composed of a low-dimensional conductive material layer, and the coil device is configured in this way such that the coil device can detect and / or generate sound inductively.

Description

technical field [0001] The invention relates to a micromechanical acoustic transducer arrangement and a corresponding production method. Background technique [0002] Although in principle applicable to any micromechanical sound transducer arrangement, such as loudspeakers and microphones, the invention and the problem on which it is based are explained with the aid of a silicon-based micromechanical microphone arrangement. [0003] Micromechanical microphone devices usually have an acoustic converter device integrated on a MEMS chip in order to convert acoustic energy into electrical energy, wherein a first electrode deflectable by the acoustic energy is capacitively connected to a fixed, perforated second electrode collective effect. The deflection of the first electrode is determined by the difference in sound pressure in front of and behind the first electrode. If the deflection changes, the capacitance of the capacitor formed by the first electrode and the second elec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
Inventor C·谢林B·施泰因R·舍本M·斯顿伯T·卢茨
Owner ROBERT BOSCH GMBH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com