Non-polar InGaN/GaN multi-quantum-well nano-pillar and preparation method thereof
A multi-quantum well and non-polar technology, which is applied in the direction of nanotechnology, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as LED bending, reduction of carrier radiation recombination efficiency, and unstable LED luminous wavelength. Reduce thermal stress, improve radiation recombination efficiency, and reduce the effect of QCSE effect
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Embodiment 1
[0048] This example was grown on LiGaO 2 The preparation method of the nonpolar InGaN / GaN multi-quantum well nanocolumn on the substrate comprises the following steps:
[0049] (1) Using LiGaO 2 For the substrate, select the crystal orientation as the epitaxial plane with the (100) plane offset by 0.5° to the (110) direction;
[0050] (2) Carry out surface polishing, cleaning and annealing treatment to substrate, the concrete process of described substrate surface polishing is: first LiGaO 2 The surface of the substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then the method of chemical mechanical polishing is used for polishing; the specific process of cleaning is: the LiGaO 2 The substrate was ultrasonically cleaned in deionized water for 3 minutes at room temperature to remove LiGaO 2 Contamination particles on the surface of the substrate are washed with hydrochloric acid,...
Embodiment 2
[0063] This example was grown on LiGaO 2 The preparation method of the nonpolar InGaN / GaN multi-quantum well nanocolumn on the substrate comprises the following steps:
[0064] (1) Using LiGaO 2 For the substrate, select the epitaxial plane with the crystal orientation as the (100) plane offset by 1.0° to the (110) direction;
[0065] (2) Carry out surface polishing, cleaning and annealing treatment to substrate, the concrete process of described substrate surface polishing is: first LiGaO 2 The surface of the substrate is polished with diamond slurry, and the surface of the substrate is observed with an optical microscope until there are no scratches, and then the method of chemical mechanical polishing is used for polishing; the specific process of cleaning is: the LiGaO 2 The substrate was ultrasonically cleaned in deionized water for 5 minutes at room temperature to remove LiGaO 2 Contamination particles on the surface of the substrate are washed with hydrochloric acid,...
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