Structure and growth method of green LED chip epitaxial layer
A technology of LED chips and growth methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of reducing the luminous efficiency of green LED devices, increasing the probability of non-radiative recombination of carriers, and reducing the luminous efficiency of green LEDs, etc. problem, to achieve the effect of reducing the QCSE effect, reducing the degree of lattice mismatch, and reducing the confinement effect
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[0028] see figure 1 , the invention provides a structure of a green LED chip epitaxial layer, comprising:
[0029] A substrate 11, the material of the substrate 11 is sapphire, silicon, silicon carbide, gallium nitride or gallium arsenide;
[0030] A GaN buffer layer 12, grown on the substrate 11, the thickness of the GaN buffer layer 12 is 20-30nm;
[0031] a non-doped GaN layer 13, which is grown on the GaN buffer layer 12, and the thickness of the non-doped GaN layer 13 is 0.5-2.0 μm;
[0032] An N-type GaN layer 14, which is grown on the non-doped GaN layer 13, the thickness of the N-type GaN layer 14 is 1-3 μm, wherein the doping concentration of Si is greater than 10 18 / cm 3 ;
[0033] A first ladder layer 15 grown on the N-type GaN layer 14 . This layer is a non-doped InGaN layer with a low In composition, with a thickness of about 3-30 nm, and its In composition is 20%-80% of the In composition in the InGaN barrier layer 20 .
[0034] A multi-quantum well region...
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