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Acrylic thermally conductive composition, and thermally conductive sheet

An acrylic and composition technology, which is applied in semiconductor devices, cooling/ventilation/heating transformation, semiconductor/solid device components, etc., can solve the problems of softness damage, difficulty in obtaining adhesion, etc., and achieve the suppression of outgassing , the effect of excellent softness

Active Publication Date: 2017-02-22
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is concern that conventional acrylic thermally conductive sheets emit various outgasses other than siloxane gas.
In addition, conventional acrylic thermally conductive sheets are difficult to obtain excellent adhesion to heating elements and radiators due to impaired flexibility.

Method used

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  • Acrylic thermally conductive composition, and thermally conductive sheet
  • Acrylic thermally conductive composition, and thermally conductive sheet
  • Acrylic thermally conductive composition, and thermally conductive sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] As shown in Table 1, 100 parts by mass of ISTA as monofunctional acrylate, 100.00 parts by mass of DIDA as adipate, 9.87 parts by mass of polypropylene glycol diacrylate, 4.21 parts by mass of polyfunctional thiol, 2.11 parts by mass of antioxidant Parts by mass, 2.11 parts by mass of secondary antioxidant, 0.07 parts by mass of acylphosphine oxide-based photoinitiator, 0.15 parts by mass of α-hydroxyketone-based photoinitiator, 642.11 parts by mass of aluminum hydroxide with an average particle diameter (D50) of 60 to 80 μm , and 642.11 parts by mass of aluminum hydroxide having an average particle diameter (D50) of 7.4 μm were added to a mixer and kneaded to obtain an acrylic heat-conducting composition. Then, by the method described above, a thermally conductive sheet was obtained.

[0089] As shown in Table 1, the thermal conductivity of the thermally conductive resin layer in Example 1 was 1.72 W / m·K, and the compressibility was 11.30%. In addition, as a result of...

Embodiment 2

[0091] As shown in Table 1, 100 parts by mass of ISTA as monofunctional acrylate, 123.53 parts by mass of DIDS as sebacate, 12.59 parts by mass of polypropylene glycol diacrylate, 4.55 parts by mass of polyfunctional thiol, 2.38 parts by mass of antioxidant Parts by mass, 2.37 parts by mass of secondary antioxidant, 0.09 parts by mass of acyl phosphine oxide photoinitiator, 0.17 parts by mass of α-hydroxyketone photoinitiator, 717.65 parts by mass of aluminum hydroxide with an average particle diameter (D50) of 60 to 80 μm , and 717.65 parts by mass of aluminum hydroxide having an average particle diameter (D50) of 7.4 μm were added to a mixer and kneaded to obtain an acrylic heat-conducting composition. Then, by the method described above, a thermally conductive sheet was obtained.

[0092]As shown in Table 1, the thermal conductivity of the thermally conductive resin layer in Example 2 was 1.65 W / m·K, and the compressibility was 10.50%. In addition, as a result of measuring...

Embodiment 3

[0094] As shown in Table 1, 100 parts by mass of ISTA as monofunctional acrylate, 65.13 parts by mass of DIDA as adipate, 7.02 parts by mass of polypropylene glycol diacrylate, 3.55 parts by mass of polyfunctional thiol, 1.76 parts by mass of antioxidant Parts by mass, 1.73 parts by mass of secondary antioxidant, 0.06 parts by mass of acyl phosphine oxide photoinitiator, 0.12 parts by mass of α-hydroxyketone photoinitiator, 581.40 parts by mass of aluminum hydroxide with an average particle diameter (D50) of 60 to 80 μm , and 581.40 parts by mass of aluminum hydroxide having an average particle diameter (D50) of 7.4 μm were added to a mixer and kneaded to obtain an acrylic heat-conducting composition. Then, by the method described above, a thermally conductive sheet was obtained.

[0095] As shown in Table 1, the thermal conductivity of the thermally conductive resin layer in Example 3 was 1.77 W / m·K, and the compressibility was 14.48%. In addition, as a result of measuring t...

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Abstract

Provided are: an acrylic thermally conductive composition capable of forming a sheet having excellent flexibility and capable of low outgassing; and a thermally conductive sheet. An acrylic thermally conductive composition containing a monofunctional (meth)acrylate, a multifunctional (meth)acrylate, a photopolymerization initiator, thermally conductive particles, a plasticizer, and a thiol compound, wherein the plasticizer comprises one or more types selected from adipate, a pimelic acid ester, a suberic acid ester, azelate, and a sebacic acid ester. Furthermore, the thiol compound is multifunctional thiol, and the thermally conductive sheet has a thermally conductive resin layer (11) obtained by photocuring the acrylic thermally conductive composition.

Description

technical field [0001] The present invention relates to an acrylic heat-conductive composition and a heat-conductive sheet used for heat dissipation measures of electronic components and the like. This application claims priority based on Japanese Patent Application No. 2014-106581 filed in Japan on May 22, 2014, and Japanese Patent Application No. 2014-106582 filed on May 22, 2014. This application is incorporated by reference. Background technique [0002] In recent years, with the high performance of electronic equipment, measures against heat dissipation of electronic components and the like are required. In addition, precision devices such as hard disk devices and laser devices require measures against heat dissipation and outgassing from components. [0003] For example, in a hard disk drive, the density of magnetic heads is increased in order to increase the storage capacity, and the recording medium needs to be rotated at high speed by a motor in order to increase ...

Claims

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Application Information

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IPC IPC(8): C08F2/44C08F2/48C08L33/06H01L23/36H05K7/20
CPCC08F2/44C08F2/48C08L33/06H01L2924/0002H01L23/36H05K7/20H01L2924/00
Inventor 松岛昌幸
Owner DEXERIALS CORP
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