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Resin sheet with support

A technology of resin sheets and supports, applied in the field of resin sheets, can solve problems such as the limitation of installation volume, achieve the effects of reducing warpage and excellent part embedding performance

Active Publication Date: 2017-03-01
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, such components were only mounted on the surface circuit of the printed wiring board, but the amount of mounting was limited, and it was difficult to respond to the further high-function and miniaturization of printed wiring boards in recent years.

Method used

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  • Resin sheet with support
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  • Resin sheet with support

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0254] (Example 1: Production of resin sheet 1 with support)

[0255] As a support, a PET film ("Lumira T6AM" manufactured by Toray Co., Ltd.) subjected to release treatment with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Co., Ltd.) was prepared. ", thickness 38μm, softening point 130°C, "release PET").

[0256] The resin varnish 1 is evenly coated on the release PET by using a metal die coater, so that the thickness of the first resin composition layer after drying is 3 μm, and is dried on the release PET by drying at 80° C. to 160° C. for 5 minutes. Obtain the first resin composition layer on. Next, resin varnish 2 is coated on the first resin composition layer so that the total thickness of the first resin composition layer after drying is 25 μm, and dried at 70° C. to 110° C. (average 95° C.) for 4.5 minutes to form 2 varnishes. Layer resin composition layer (resin sheet). Next, on the surface of the resin sheet that is not bonded to the support (...

Embodiment 2

[0257] (Example 2: Production of resin sheet 2 with support)

[0258] A support-attached resin sheet 2 was produced in the same manner as in Example 1 except that the tandem coating method was used instead of the secondary coating. Specifically, coating was performed using a die coater so that the resin varnish 1 was dried to a thickness of 3 μm, and after pre-drying at 130° C. for 0.8 minutes, the resin was coated on the resin varnish 1 using a die coater. Varnish 2 was obtained in the same manner as in Example 1 except that the total thickness of the varnish 2 and the first resin composition layer after drying was 25 μm and dried at 80° C. to 110° C. (average 100° C.) for 4 minutes. Resin sheet 2. It should be noted that in order to measure the melt viscosity of each resin composition layer alone, the following resin composition layer was also produced: coating on the release PET so that the resin varnish 1 was dried to form a thickness of 3 μm, and carried out at 130° C. ...

Embodiment 3

[0259] (Example 3: Production of resin sheet 3 with support)

[0260] In Example 1, except having used the resin varnish 3 instead of the resin varnish 2, it carried out similarly to Example 1, and obtained the resin sheet 3 with a support body. In this example, resin varnish 1 was used as the first resin composition, and resin varnish 3 was used as the second resin composition.

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Abstract

Provided is a resin sheet with a support, which reduces warping of a substrate and is excellent in part embedding property. A resin sheet comprises a support and is arranged on the support. The resin sheet comprises a first resin composition layer provided on the support side and a second resin composition layer provided on the side opposite to the support;the second resin composition layer is formed by a second resin composition having a composition different from the compostion of the first resin composition to be formed; the minimum melt viscosity of the resin sheet is 6000 poise or less; and the average coefficient of linear thermal expansion of the cured resin layer solidifying the resin sheet is 17 ppm / DEG C or less at the temperauter of 25 to 150 DEG C.

Description

technical field [0001] The present invention relates to a resin sheet with a support, a method of manufacturing a circuit board with built-in components, and a semiconductor device. Background technique [0002] In recent years, the demand for small and high-function electronic devices such as smartphones and tablet PCs has been increasing. Along with this, further enhancements in functionality and miniaturization of printed wiring boards used in these small electronic devices are required. [0003] Install bare chips, chip capacitors, chip inductors and other components on printed circuit boards. Conventionally, such components have been mounted only on the surface circuits of printed wiring boards, but the amount of mounting is limited, making it difficult to meet the demands for higher functionality and miniaturization of printed wiring boards in recent years. [0004] As a solution to the above-mentioned problems, a component-embedded circuit board has been proposed in...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/30
CPCH05K1/0271H05K3/30H05K2203/1105H05K2201/068B32B27/08B32B27/20B32B2363/00B32B2457/08B32B38/0036B32B38/1858B32B37/1018B32B2309/68
Inventor 宮本亮中村茂雄
Owner AJINOMOTO CO INC