A kind of epoxy damping glue curable at room temperature and preparation method thereof

Abstract

An epoxy damping adhesive curable at room temperature and a preparing method thereof are disclosed. The epoxy damping adhesive is prepared by mixing a first weight component (A) raw material and a second weight component (B) raw material according to a weight ratio of 100:30-100. The first weight component (A) includes 10-30 parts of multiple-epoxy-group epoxy resin, 40-80 parts of double-epoxy-group epoxy resin, 0-60 parts of single-epoxy-group epoxy resin, 0.5-2 parts of a defoamer and 5-15 parts of a heat conducting agent. The second weight component (B) includes 30-60 parts of a curing agent, 0-60 parts of single-epoxy-group epoxy resin and 0-3 parts of a promoter. The epoxy damping adhesive has characteristics of the simple preparing method, using convenience, slow heat release, a high material loss factor, a wide temperature range, high adhesive strength, not liable cracking or flakes, excellent electrical performance and good chemical corrosion resistance, and is similar to soft rubber. The loss factor of the epoxy damping adhesive is greater than 1.2, the temperature range is more than 60 DEG C, and damping adhesives having a high damping value in different temperature ranges can be prepared through adjusting using amounts of epoxy resin having different epoxy group amounts.

Description

technical field [0001] The invention relates to an epoxy damping adhesive curable at room temperature and a preparation method thereof, belonging to the technical field of damping materials. Background technique [0002] Damping material is a new type of functional material that can absorb vibration mechanical energy and convert it into heat energy for dissipation. Mechanical equipment and vehicles will produce different levels of vibration and noise during work. People try to control vibration and noise. Using damping materials is one of the effective anti-vibration and noise reduction methods. People have studied and used various types of damping materials. There are many Chinese patents related to damping materials and their manufacturing methods, and the ones that are relatively close to the technology of the present invention are: the patent number is 200810140889.8. The name is "A kind of epoxy resin-based piezoelectric composite damping material and its preparation me...

AI Technical Summary

Problems solved by technology

These four patents all involve damping materials and their preparation methods. The damping materials prepared by them have different degrees of improvement in mechanical properties and damping performance, but the epoxy resin and curing agent used in the above damping material preparation methods are expensive, which not only increases Manufacturing cost, and the epoxy damping material prepared by its preparation method has been tested, and the loss factor is low, which cannot achieve satisfactory noise reduction and vibration reduction effects