A graphite flake/copper composite material for vertically oriented heat dissipation and its preparation method

A technology of graphite flakes and composite materials, which is applied in the direction of semiconductor/solid-state device parts, electrical components, circuits, etc., can solve heat dissipation and other problems, and achieve the effects of good directional thermal conductivity, low raw material cost, and easy cutting and processing

Active Publication Date: 2018-03-09
HUNAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing graphite flake-reinforced metal matrix composites can only dissipate heat in the two-dimensional plane direction, and cannot do directional heat dissipation in the vertical direction. Graphite flake / copper composite material oriented and exported along the vertical direction of the plane where the chip is located and its preparation method

Method used

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  • A graphite flake/copper composite material for vertically oriented heat dissipation and its preparation method
  • A graphite flake/copper composite material for vertically oriented heat dissipation and its preparation method
  • A graphite flake/copper composite material for vertically oriented heat dissipation and its preparation method

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Embodiment 1

[0030]In this embodiment, the graphite flakes have a thickness of 10 μm and an average diameter of 200 μm. Firstly, electroless copper plating treatment is carried out on the surface of the graphite flakes: put the graphite flakes into a NaOH solution with a mass fraction of 20%, rinse and stir for 15 minutes, let stand and pour off the solution, and rinse with ionized water until neutral. Put the washed graphite flakes into 20ml / L HCl+20g / L SnCl 2 Sensitization reaction in the solution: Stir vigorously for more than 15 minutes until the solution turns blue-gray, let it stand and pour off the excess solution. Activation stage: Add 20ml / L HCl+0.5g / L PdCl to the sensitized graphite flakes 2 The solution was vigorously stirred for more than 15 minutes, and the reaction was complete when the solution turned light brown. Pour the sensitized and activated graphite flakes into the copper plating bath, and the treatment amount of graphite is 1g / L. The formula of the plating solutio...

Embodiment 2

[0035] In this embodiment, the graphite flakes have a thickness of 10 μm and an average diameter of 150 μm. Firstly, electroless copper plating treatment is performed on the surface of the graphite flakes: the graphite flakes are put into a 20% NaOH solution by mass fraction, rinsed and stirred for 15 minutes, left to stand and poured off the solution, and rinsed with ionized water until neutral. Put the washed graphite flakes into 20ml / L HCl+20g / L SnCl 2 Sensitization reaction in the solution: Stir vigorously for more than 15 minutes until the solution turns blue-gray, let it stand and pour off the excess solution. Activation stage: Add 20ml / L HCl+0.5g / L PdCl to the sensitized graphite flakes 2 The solution was vigorously stirred for more than 15 minutes, and the reaction was complete when the solution turned light brown. Pour the sensitized and activated graphite flakes into the copper plating bath, and the treatment amount of graphite is 1g / L. The formula of the plating ...

Embodiment 3

[0040] In this example, graphite flakes with a thickness of 5 μm and an average diameter of about 70 μm and a thickness of 10 μm and an average diameter of about 150 μm were selected as the reinforcing phase by mixing them at a volume ratio of 1:1. Electroless copper plating on the surface of the graphite flakes: put the graphite flakes into a NaOH solution with a mass fraction of 20%, rinse and stir for 15 minutes, let stand and pour off the solution, and rinse with ionized water until neutral. Put the washed graphite flakes into 20ml / L HCl+20g / L SnCl 2 Sensitization reaction in the solution: Stir vigorously for more than 15 minutes until the solution turns blue-gray, let it stand and pour off the excess solution. Activation stage: Add 20ml / L HCl+0.5g / L PdCl to the sensitized graphite flakes 2 The solution was vigorously stirred for more than 15 minutes, and the reaction was complete when the solution turned light brown. Pour the sensitized and activated graphite flakes int...

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Abstract

The invention discloses a graphite flake / copper composite material for vertically oriented heat dissipation and a preparation method thereof. The composite material of the invention is formed by mixing highly oriented graphite flake reinforcements and matrix copper. The preparation method of the invention comprises the steps of plating copper layer on the surface of graphite flakes, flaking the copper powder by ball milling, forming a preform, pressing and sintering to set the shape, and the like. The product of the present invention has a low and adjustable thermal expansion coefficient perpendicular to the scale-like direction, and the thermal expansion coefficient is 4-10×10-6K-1, which can effectively avoid affecting other devices on the same plane; the directional thermal conductivity is good : The thermal conductivity parallel to the scale direction is high, and the thermal conductivity perpendicular to the scale direction is lower than 50W·m‑1·K‑1. In addition, the product of the present invention is easy to cut, can be made into complex shapes to meet the design of heat dissipation lines, and the cost of raw materials used is relatively low, which is suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of high-performance electronic packaging functional materials, and in particular relates to a graphite flake / copper composite material for vertical directional heat dissipation in which the direction of high thermal conductivity and the direction of low thermal expansion coefficient are perpendicular to each other and a preparation method thereof. Background technique [0002] With the rapid development of large-scale integrated circuits, the power density of electronic devices continues to increase, and the heat dissipation problem of high-power electronic devices has gradually become the key to restricting the further improvement of the power of electronic devices. The development of heat dissipation materials for electronic packaging with high thermal conductivity, low and adjustable thermal expansion coefficient is the most effective means to solve the heat dissipation problem of electronic devices. To this end, r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/05H01L23/373
Inventor 刘骞陈友明成娟娟唐思文康永海胡海蓉
Owner HUNAN UNIV OF SCI & TECH
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