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A kind of reinforced composite material with honeycomb structure and preparation method thereof

A composite material, structural enhancement technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, to achieve high material utilization, good directional thermal conductivity, and achieve the effect of hierarchical management

Active Publication Date: 2017-12-26
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The honeycomb structure material is characterized by high strength and light weight, and is mostly used in the aerospace field. It is an ultra-light composite material developed in response to the special needs of aerospace technology. There are few reports on high thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1: Aluminum composite material reinforced with diamond honeycomb structure

[0036] Include the following steps:

[0037] (1) Choose the Cu honeycomb unit height as 1mm, first carry out surface treatment, remove the oil stain on the surface of the honeycomb substrate with acetone, remove the oxide on the surface of the honeycomb substrate with pickling, wash with water to remove the acid solution, and finally, anhydrous Ultrasonic cleaning with ethanol; using magnetron sputtering to sputter a W film on the surface of the honeycomb substrate, wherein the thickness of the W film is 150nm;

[0038] (2) The diamond film was deposited on the surface of the modified honeycomb substrate by hot wire CVD. The deposition process parameters were: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2200°C, deposition pressure 3KPa, deposition time 60 hours, CH 4 / H 2 The volume flow ratio is 1:99; the Mo / Ni / Cu composite film is sputtered on the surfac...

Embodiment 2

[0040] Example Two: Diamond / Graphene Honeycomb Structure Reinforced Epoxy Resin Composite

[0041] Include the following steps:

[0042] (1) The height of the Ni honeycomb unit is selected as 0.5mm, and the surface treatment is carried out first, and the oil stain on the surface of the honeycomb substrate is removed with acetone, and after the oxide on the surface of the honeycomb substrate is removed by pickling, the acid solution is removed by washing with water, and finally, no Ultrasonic cleaning with water and ethanol; sputtering a Mo film on the surface of the honeycomb substrate by magnetron sputtering, wherein the thickness of the Mo film is 250nm;

[0043] (2) The diamond film was deposited on the surface of the modified honeycomb substrate by hot wire CVD. The deposition process parameters were: hot wire distance 6mm, substrate temperature 850°C, hot wire temperature 2200°C, deposition pressure 3KPa, deposition time 100 hours, CH 4 / H 2 The volume flow ratio is 1:9...

Embodiment 3

[0045] Example 3: Diamond / carbon nanotube honeycomb structure reinforced copper-based composite material and its preparation method

[0046] Include the following steps:

[0047] (1) Choose the Cu honeycomb unit height as 2mm, first carry out surface treatment, remove the oil stain on the surface of the honeycomb substrate with acetone, remove the oxide on the surface of the honeycomb substrate with pickling, wash with water to remove the acid solution, and finally, anhydrous Ultrasonic cleaning with ethanol; using magnetron sputtering to sputter a W film on the surface of the honeycomb substrate, wherein the thickness of the W film is 150nm;

[0048] (2) The diamond film was deposited on the surface of the modified honeycomb substrate by hot wire CVD. The deposition process parameters were: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2200°C, deposition pressure 3KPa, deposition time 200 hours, CH 4 / H 2 The volume flow ratio is 1:99; the Mo / Ni / C...

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Abstract

A honeycomb structure reinforced composite material and its preparation method, the composite material is composed of a honeycomb substrate material, a high thermal conductivity film layer, a matrix material and high thermal conductivity particles, the honeycomb substrate material is metal, and the high thermal conductivity material can be diamond , graphene, carbon nanotubes in a single substance or multiple composites, and the matrix material is a high thermal conductivity metal material or polymer material. The composite material of the invention forms continuous rapid heat conduction channels along the direction of the honeycomb structure, and has better directional heat conduction performance along the honeycomb axis, can realize hierarchical management of heat to a certain extent, and has higher material utilization rate. In addition, the honeycomb structure has the characteristics of strong designability, stable quality, high strength and light weight, which can meet the needs of aerospace, ships, transportation and other fields for high-performance light-weight heat dissipation materials. Suitable for industrial applications.

Description

technical field [0001] The invention discloses a honeycomb structure reinforced composite material and a preparation method thereof, belonging to the technical field of composite material preparation. Background technique: [0002] The rapid development of modern science and technology allows us to enjoy the convenience brought by its achievements, but also brings more and more challenges to scientific research. With the rapid development of the electronic information industry, diversification, ultra-high integration, miniaturization, and heterogeneity have become the development direction of electronic devices. The requirements for packaging materials have naturally increased, and various heat-conducting materials have also come out one after another. Divided from the matrix, there are metal base, ceramic base, polymer base, etc.; from the reinforcement, there are diamond, graphene, carbon nanotubes, etc.; from the structure of the reinforcement, there are zero-dimensional...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10C22C1/05C22C26/00C23C16/26C23C16/27C23C16/50C08L63/00C08L83/04C08K9/10C08K3/08C08K7/24
CPCC22C1/05C22C1/1036C22C26/00C23C16/26C23C16/27C23C16/50C08K3/08C08K7/24C08K9/10C08K2003/0862C22C1/1052C22C1/1073C08L63/00C08L83/04
Inventor 周科朝魏秋平马莉余志明张龙叶文涛张岳峰
Owner CENT SOUTH UNIV
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