Special-shaped hole burr removing and hole metalizing method

A hole metallization and deburring technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the impact of product functionality, customer impact on electrical conduction performance of slots, and burrs in holes, etc. problems, to achieve fast evaporation rate, meet the performance of circuit boards, and achieve the effect of smooth surface

Inactive Publication Date: 2017-03-22
GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Drilling is one of the key processes in the circuit board process. During the production of circuit boards, the quality control and process control requirements are relatively high, especially related to the electrical conduction performance of the circuit board, which will have a significant impact on product functionality. In the production process of drilling, some heterosexual slots are different from the general inline slots and round holes. It is inevitable that there will be burrs in the holes where the special slots intersect. The internal electrical conduction performance and the customer's serious impact on the process of assembly and use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A method for deburring special-shaped holes and hole metallization, comprising the following steps: S1. After drilling special-shaped holes on a circuit board, apply a micro-corrosion reagent evenly on the surface of the circuit board in the drilled hole area; S2. Blow dry with a fan For laminates, blow out the dust on the surface of the circuit board and in the hole; S3. After deburring, perform magnetron sputtering plating on the inner wall of the special-shaped hole of the circuit board.

[0017] In the step S3, the thickness of the copper layer formed by magnetron sputtering is 0.24 μm.

[0018] In step S3, the method of magnetron sputtering is: the sputtering target is 99.999% high-purity copper, the diameter of the metal is 19mm, and the thickness is 1.8mm; the distance between the target and the substrate is 13.6cm, and the working gas is 99.99% high-purity nitrogen and 99.99% high-purity argon are controlled by mass flow meters respectively; before the substrate...

Embodiment 2

[0024] A method for deburring special-shaped holes and hole metallization, comprising the following steps: S1. After drilling special-shaped holes on a circuit board, apply a micro-corrosion reagent evenly on the surface of the circuit board in the drilled hole area; S2. Blow dry with a fan For laminates, blow out the dust on the surface of the circuit board and in the hole; S3. After deburring, perform magnetron sputtering plating on the inner wall of the special-shaped hole of the circuit board.

[0025] In the step S3, the thickness of the copper layer formed by magnetron sputtering is 0.18 μm.

[0026] In step S3, the method of magnetron sputtering is: the sputtering target is 99.999% high-purity copper, the diameter of the metal is 15mm, and the thickness is 1mm; the distance between the target and the substrate is 12cm, and the working gas is 99.99% The high-purity nitrogen gas and 99.99% high-purity argon gas are controlled by mass flow meters respectively; before the s...

Embodiment 3

[0032] A method for deburring special-shaped holes and hole metallization, comprising the following steps: S1. After drilling special-shaped holes on a circuit board, apply a micro-corrosion reagent evenly on the surface of the circuit board in the drilled hole area; S2. Blow dry with a fan For laminates, blow out the dust on the surface of the circuit board and in the hole; S3. After deburring, perform magnetron sputtering plating on the inner wall of the special-shaped hole of the circuit board.

[0033] In the step S3, the thickness of the copper layer formed by magnetron sputtering is 0.35 μm.

[0034] In step S3, the method of magnetron sputtering is: the sputtering target is 99.999% high-purity copper, the diameter of the metal is 25mm, and the thickness is 3mm; the distance between the target and the substrate is 15cm, and the working gas is 99.99% The high-purity nitrogen gas and 99.99% high-purity argon gas are controlled by mass flow meters respectively; before the s...

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Abstract

The invention provides a special-shaped hole burr removing and hole metalizing method. According to the method, a tiny corrosive agent is used for ensuring that hole opening burrs can be removed completely, and the problem that in the manufacturing process of the following working procedure, due to the fact that a dry membrane is punctured, no copper exists in holes or copper wires are formed in the holes, and hidden quality danger is caused is solved. According to the method, the used tiny corrosive agent does not influence performance of a circuit board, the burr removing effect is good, moreover, the evaporation speed is high, the influence on follow-up machining is avoided, and the treatment efficiency of hole opening burrs can be improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for deburring and metalizing a special-shaped hole. Background technique [0002] Drilling is one of the key processes in the circuit board process. During the production of circuit boards, the quality control and process control requirements are relatively high, especially related to the electrical conduction performance of the circuit board, which will have a significant impact on product functionality. In the production process of drilling, some heterosexual slots are different from the general inline slots and round holes. It is inevitable that there will be burrs in the holes where the special slots intersect. It will have a serious impact on the internal electrical conduction performance and the customer's assembly and use process. Contents of the invention [0003] In view of this, the present invention provides a method for deburri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/00C23C14/35
CPCC23C14/046C23C14/35
Inventor 刘继承畅进辉邹乾坤
Owner GUANGDONG CHAMPION ASIA ELECTRONICS CO LTD
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