Sputtering thin film temperature-pressure composite sensor and manufacturing method thereof

Abstract

The invention discloses a sputtering thin film temperature-pressure composite sensor and a manufacturing method thereof, which can measure temperature and pressure of a high-low-temperature gaseous or liquid medium. The sputtering thin film temperature-pressure composite sensor comprises a joint, a sensitive element, copper columns, a compensating plate, gold lead wires, sleeves, a signal processing circuit board, an outer shell, lead wires, fastening screws, an aviation socket and a socket base, wherein four thin-film resistors used for measuring pressure are processed on the sensitive element by adopting a sputtering thin film technology, and two thin-film resistors used for measuring temperature are further processed in a tiny deformation region on the periphery of the pressure-measuring thin-film resistors; the four pressure-measuring thin-film resistors are connected with the compensating plate in a switch-over manner and are bridged by means of the gold lead wires, the two temperature-measuring thin-film resistors lead out four of the gold lead wires to be switched into lead wires by means of the compensating plate and connected to the signal processing circuit board, and bridge forming and compensation are completed on the signal processing circuit board. The sputtering thin film temperature-pressure composite sensor is based on the original sputtering thin film temperature-pressure composite sensor manufacturing process, and hardly increases any production and application cost.

Description

technical field [0001] The invention relates to a sputtering film temperature and pressure composite sensor and its manufacturing method, especially suitable for the simultaneous measurement of gas and liquid temperature and pressure under the requirements of low cost, low power consumption, high reliability, high stability and long life occasions, or the need to increase the temperature measurement function at the measurement point that originally only had the pressure measurement function. For the construction of complex intelligent sensor networks, as well as some industrial environments, military equipment, aerospace and navigation, etc., it is very practical to use it when it is difficult to upgrade or change the original equipment and system, and at the same time the pressure measurement interface cannot be changed. significance. Background technique [0002] Pressure and temperature sensors are widely used in various fields such as industrial production, military equ...

AI Technical Summary

Problems solved by technology

However, most of the existing temperature and pressure composite sensors on the market are simply mechanically piecing together temperature and pressure sensors. For example, some just add a digital temperature sensor to the pressure sensor, which can only provide a very rough temperature measurement function. ; Although some use platinum resistance or thermocouples and other temperature measuring devices with excellent performance, the devices are pasted on the pressure measurement sensitive element, the contact area between the device and the pressure measurement sensitive element is very small, and the measured value is different from the actual temperature of the medium. Larger; some have holes in the sensor and insert the temperature probe directly into the medium to obtain ideal temperature measurement values, but such sensors are difficult to package, usually have the disadvantages of system leakage risk, large volume, and high price; in addition, In some special applications such as military industry, there is also a method of sputtering an alloy film for pressure measurement and a heat-sensitive film for temperature measurement on the sensitive element using the sputtering film process, but the principle of this implementation is the same as that used in sensitive components. The principle of pasting heat-sensitive components such as platinum resistors on the components is similar, and because multiple sputtering and photolithography are required, not only the consistency and yield will be affected, but the cost is also very high

In addition, the signal processing and signal output of the above-mentioned temperature and pressure composite sensors are clearly separated, which are basically equivalent to two sets of signal processing systems. The value usually needs to be introduced into an embedded system, a host computer, etc. to achieve

In addition, some temperature and pressure composite measurement methods (such as laser optical fiber measurement of pressure and temperature) are generally only used in extremely special measurement occasions due to lack of sufficient verification and high cost.

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