An ultra-thin flexible heat dissipation film and its manufacturing method

A heat dissipation film and flexible technology, applied in the field of flexible heat dissipation film and its production, can solve the problems of increased thermal resistance, difficulty in punching graphite pressed materials, unfavorable use, etc., achieve high thermal conductivity and heat dissipation performance, excellent heat dissipation performance, and easy processing and use Effect
CN106531902BActive Publication Date: 2020-12-29广州宏庆电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
广州宏庆电子有限公司
Publication Date
2020-12-29

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Abstract

The invention discloses a flexible heat dissipation film and a preparation method thereof, and the invention relates to the field of electronic materials. The heat dissipation film includes a carrier film and a protective film layer, and at least one heat dissipation layer group between the carrier film and the protective film layer; The heat dissipation metal film layer on one surface of the heat dissipation adhesive film layer is used for longitudinal heat transfer, thereby forming a heat dissipation layer group with two-way heat transfer; wherein, the raw materials of the heat dissipation adhesive film layer include magnetized high thermal conductivity powder and Resin; wherein, the heat dissipation metal film is formed by depositing the material source on the surface of the heat dissipation adhesive film layer after forming atoms or molecules by physical means. The heat dissipation film of the present application is easy to operate, and the formed film layer is thin and dense, and is suitable for various electronic products and communication equipment.
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Description

technical field

[0001] The invention belongs to the field of electronic materials, in particular to a flexible heat dissipation film and a manufacturing method thereof. Background technique

[0002] With the rapid development of the electronics industry, the development of small, light, and thin mobile phones, and the replacement of display panels, especially the rise of OLEDs, all internal materials are required to be flexible, resistant to bending, and thin, light, and easy to use. Processing, low cost, especially the higher and higher requirements for heat dissipation.

[0003] At present, graphite materials (including artificial graphite, natural graphite and graphene) are mainly used, which are bonded by adhesives. Graphite material has excellent thermal conductivity, but it is difficult to process and use directly. Generally, it needs to be bonded with adhesives. Adding an adhesive layer with low thermal conductivity (generally thermal conductivity lower than 1W / K / m) ...

Claims

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