Phenolic resin thermal insulation board and preparation method thereof

A phenolic resin and thermal insulation board technology, applied in the field of building thermal insulation materials, can solve the problems of poor toughness and low strength of thermal insulation boards, and achieve the effects of excellent thermal insulation performance, high fire performance and good toughness

Inactive Publication Date: 2017-04-05
ZHENGZHOU HOLLOWLITE MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a phenolic resin insulation board and its preparation method, which can solve the technical problems of poor toughness and low strength of the existing phenolic resin insulation board

Method used

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  • Phenolic resin thermal insulation board and preparation method thereof
  • Phenolic resin thermal insulation board and preparation method thereof
  • Phenolic resin thermal insulation board and preparation method thereof

Examples

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preparation example Construction

[0041] The present invention also provides a preparation method of phenolic resin insulation board, comprising the following steps:

[0042] Weigh the components of phenolic resin, plant fiber, dopamine hydrochloride, foaming agent, heat stabilizer, surfactant, and inorganic filler into the stirring tank, and stir evenly to obtain the mixture;

[0043] Then add a curing agent to the mixture, after foaming, curing and aging, the mold is released to obtain a phenolic resin insulation board.

[0044] Wherein, the phenolic resin, plant fiber, dopamine hydrochloride, foaming agent, heat stabilizer, surfactant, inorganic filler and curing agent are all the same as above, and will not be repeated here.

[0045] The preparation method of the above technology is simple and easy to operate, and the prepared phenolic resin insulation board has excellent compression resistance, heat preservation performance, strength and toughness.

[0046] In an embodiment of the present invention, the ...

Embodiment 1

[0051] Add 25kg of hollow glass microspheres to 150kg of water, stir well and add 3kg of dopamine hydrochloride; after standing in the dark for 18 hours, add 50kg of phenolic resin, 10kg of corn stalk fiber, 2kg of n-pentane, 1kg of 2-(2' -Hydroxy-5'-methylphenyl) benzotriazole, 0.5kg sodium lauryl sulfate, after stirring, obtain compound;

[0052] Then add 3kg of tetrahydrophthalic anhydride to the mixture, and after foaming, curing, and aging, release the mold to obtain a phenolic resin insulation board.

[0053] The phenolic resin insulation board prepared in Example 1 has excellent thermal stability and can be used for a long time at 150°C.

Embodiment 2

[0055] Add 40kg of vitrified microspheres into 160kg of water, stir well and add 10kg of dopamine hydrochloride; after standing in the dark for 24 hours, add 80kg of phenolic resin, 10kg of rice husk fiber, 10kg of straw fiber, 5kg of n-heptane, 3kg of poly [(1-(β-ethyl)-2,2,6,6-tetramethyl-4-piperidinyl) succinic acid] ester, 3kg sodium lignosulfonate, stir to obtain the mixture;

[0056] Then add 12 kg of cyclopentetate dianhydride to the mixture, and release the mold after foaming, curing, and aging to obtain a phenolic resin insulation board.

[0057] The phenolic resin insulation board prepared in Example 2 has excellent thermal stability and can be used for a long time at 150°C.

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Abstract

The invention discloses a phenolic resin thermal insulation board and a preparation method thereof. The phenolic resin thermal insulation board comprises: 50-80 parts by weight of phenolic resin, 10-20 parts by weight of resin fiber, 3-10 parts by weight of dopamine hydrochloride, 3-12 parts by weight of a curing agent, 2-5 parts by weight of a foaming agent, 0.5-3 parts by weight of a surfactant, 1-3 parts by weight of a heat stabilizer, and 25-40 parts by weight of inorganic filler, which is selected from one or more of hollow glass beads, vitrified microspheres, and expanded perlite and has a particle size of 80-100 micrometers. The phenolic resin thermal insulation board provided by the invention adopts phenolic resin, plant fiber, dopamine hydrochloride, the curing agent, the foaming agent, the surfactant, the heat stabilizer and inorganic filler as the raw materials, dopamine hydrochloride can improve the fusion of inorganic filler and phenolic resin, so that the inorganic filler can be evenly dispersed in the phenolic resin thermal insulation board to avoid the scaling-off problem. Plant fiber can endow the phenolic resin thermal insulation board with excellent thermal insulation properties, high strength and good toughness at the same time.

Description

technical field [0001] The invention relates to the field of building thermal insulation materials, in particular to a phenolic resin thermal insulation board and a preparation method thereof. Background technique [0002] Phenolic resin insulation board is made of phenolic foam resin. Phenolic foam resin is a new type of non-combustible, fireproof and low-smoke insulation material. It is a closed-cell rigid foam made of phenolic resin with foaming agent, curing agent and other additives. plastic. Its most prominent features are non-combustibility, low smoke, and high temperature disparity resistance. It overcomes the shortcomings of the original foam plastic insulation material, such as flammability, smoke, and thermal deformation, and retains the original foam plastic insulation material. Light weight and convenient construction Features. However, phenolic resin insulation boards also have many problems, such as poor toughness and low strength. Contents of the inventio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L97/02C08K13/04C08K7/28C08K7/20C08K7/26C08K5/3475C08J9/14C08J9/08C08J9/04
CPCC08J9/04C08J9/08C08J9/141C08J2203/02C08J2203/14C08J2361/06C08J2497/02C08K2201/003C08L61/06C08L2201/08C08L2203/14C08L2205/025C08L2205/03C08L2205/035C08L2205/16C08L97/02C08K13/04C08K7/28C08K5/41C08K5/3475C08K5/17C08K7/20C08K5/42C08K2003/265C08K5/098C08K7/26
Inventor 蔡耀武张英才曾荣平蔡新奇蔡建武何南
Owner ZHENGZHOU HOLLOWLITE MATERIALS CO LTD
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