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Wafer-level packaged LED device and segmentation unit and manufacturing method thereof

An LED device, wafer-level technology, applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve problems such as high cost-effectiveness, and achieve the effect of improving overall performance, simple and efficient processes, and reducing blue light side leakage

Active Publication Date: 2017-04-05
SHANGHAI XINYUANJI SEMICON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantages of CoB are: soft light, simple circuit design, high cost-effectiveness, system space saving, etc., but there are technical problems in chip integration brightness, color temperature adjustment and system integration

Method used

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  • Wafer-level packaged LED device and segmentation unit and manufacturing method thereof
  • Wafer-level packaged LED device and segmentation unit and manufacturing method thereof
  • Wafer-level packaged LED device and segmentation unit and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0083] Fabrication of Wafer Level Packaged LED Devices

[0084] Step 1: Provide phosphor transparent substrate

[0085] The material of the transparent substrate 101 has a high light transmittance, and is easy to be processed by mechanical or chemical corrosion. In this embodiment, SiO with a thickness of 80 microns is used. 2 base glass. The back side of the transparent substrate 101 (that is, the surface without phosphor colloid 102 , the final light-emitting surface of the LED device) is processed into a tooth-shaped microstructure 104 to improve the light efficiency of the device.

[0086] The transparent substrate 101 includes periodic grooves 103 (groove length 14mil, groove width 28mil), and phosphor colloid 102 (phosphor colloid thickness 30 microns) is arranged in the groove 103, wherein, each individual groove 103 and phosphor colloid 102 to form a phosphor unit. The fluorescent powder colloid 102 is a mixed colloid of fluorescent powder and silica gel with a weight...

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Abstract

The invention relates to the field of semiconductor illumination and particularly relates to a wafer-level packaged LED device and a segmentation unit and manufacturing method thereof. The wafer-level packaged LED device includes an LED chip wafer including an LED chip and a phosphor transparent substrate, the phosphor transparent substrate includes a transparent substrate and a phosphor colloid on the transparent substrate, and the surface of the phosphor colloid is combined with the light-existing surface of the LED chip. The wafer-level packaged LED device is segmented into an LED device of a phosphor unit. The wafer-level packaged LED device is manufactured by the combination of wafer-level packaging and an LED chip wafer reversing structure. The obtained LED device improves the light-emitting efficiency, light-existing uniformity and reliability and reduces the blue light edge leakage, and the manufacturing method is efficient and rapid, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor lighting, in particular to a wafer-level packaged LED device, a division unit and a manufacturing method thereof. Background technique [0002] In recent years, LED (Light Emitting Diode) product lighting has developed rapidly. Compared with traditional light sources, LED has the advantages of long life, small size, energy saving, high efficiency, fast response, shock resistance, and no pollution. It is considered to be a "green lighting source" that can enter the field of general lighting. [0003] As a connecting link in the LED industry chain, LED product packaging plays a key role in the entire industry chain. For packaging, the key technology boils down to how to extract as much light as possible from the chip within a limited cost range, while reducing the thermal resistance of the package and improving reliability. In the packaging process, packaging materials and packaging methods are the ma...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/64H01L21/78
CPCH01L21/78H01L33/48H01L33/54H01L33/64H01L33/642
Inventor 郝茂盛张楠袁根如
Owner SHANGHAI XINYUANJI SEMICON TECH