Preparation method of tubular rotating high-purity silicon sputtering target
A sputtering target, high rotation technology, applied in the direction of sputtering coating, metal material coating process, vacuum evaporation coating, etc., can solve the problem of insufficient relative density, poor conductivity of the target material, and poor sputtering effect Good and other problems, to achieve the effect of improving key quality indicators, improving product performance, and increasing coating rate
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[0006] The specific content of the present invention will be described in detail below through specific embodiments.
[0007] A method for preparing a tubular rotating high-purity silicon sputtering target, comprising the following steps: target substrate tube preparation: selecting and inspecting the required type of target substrate tube; substrate tube surface pretreatment: putting the target substrate tube into the substrate tube pre-treatment The treatment equipment carries out sandblasting and roughening, spraying and priming bonding layer, and obtains the target substrate tube to be sprayed; silicon powder raw material preparation: weighing content: 99.95%-99.99%, oxygen content ≤ 1500ppm, particle size 45-150μm silicon powder; drying: place the obtained silicon powder raw material in a drying furnace to dry; vacuum plasma spraying: place the target base tube in a sealed spraying chamber, use a high-power supersonic plasma spraying gun, and use plasma The body is the he...
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