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Flex-rigid printed circuit board and preparation process thereof

A technology for printed circuit boards and flexible-rigid boards, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of high production cost, long production process, complicated process, etc., achieve easy steps, improve production efficiency, Simple preparation process

Inactive Publication Date: 2017-04-26
高德(江苏)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional production method of flexible and rigid boards is to make the bent board and soft board in the stack first, and then press the part that needs to be bent with a layer of covering film, and then gradually add layers or proceed to the next step of production, and finally complete the soft board. Hard-combined with the production of printed circuit boards, this production process is the production mode of most processing factories. Its production process is long, the process is complicated, and the corresponding production cost is high.

Method used

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  • Flex-rigid printed circuit board and preparation process thereof
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  • Flex-rigid printed circuit board and preparation process thereof

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] Such as Figure 1-Figure 4 As shown, a rigid-flex printed circuit board includes a soft board layer, an upper RCC material layer, a lower RCC material layer, a first prepreg, a second prepreg, a first copper foil layer and a second copper foil layer, and the soft board layer The upper layer of the soft board is provided with an upper RCC material layer, the lower layer of the flexible board is provided with a lower RCC material layer, the upper RCC material layer is provided with a first prepreg, the first prepreg is provided with a first copper foil layer, and the lower RCC material layer A second prepreg layer is provided under the second prepreg layer, a second copper foil layer is provided under the second prepreg layer, a bending part is provided in the middle of the soft board layer, and the length of the bending part is at least 5mm;

[0029] The soft bo...

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Abstract

The present invention relates to a flex-rigid printed circuit board and a preparation process thereof. The upper layer of a flexible board layer is provided with an upper RCC material layer; the lower layer of the flexible board layer is provided with a lower RCC material layer; a first prepreg is arranged on the upper RCC material layer; a first copper foil layer is arranged on the first prepreg; a second prepreg is arranged under the lower RCC material layer; a second copper foil layer is arranged under the second prepreg; and the middle of the flexible board layer is provided with a bent portion. When the flex-rigid printed circuit board is prepared, a flexible board is adopted as an intermediate layer, the upper RCC material layer is laminated on the upper surface layer of the flexible board layer, the lower RCC material layer is laminated on the lower surface layer of the flexible board layer; and the middle portions of the upper RCC material layer and the lower RCC material layer are etched, so that copper foil at the middle portions can be removed, and the bent portion of the flexible board layer is exposed. The preparation process is simple; and the steps of the preparation process are easy to operate. According to the preparation process, the RCC material layers are applied to the flex-rigid printed circuit board, and therefore, the processing procedures of the process can be reduced, production efficiency is improved, and production costs can be reduced.

Description

technical field [0001] The invention relates to a soft-hard combined printed circuit board and a preparation process thereof, belonging to the technical field of PCB production. Background technique [0002] With the development trend of thinner, more integrated and multi-functional consumer electronic products, the requirements for the manufacturing process of printed circuit boards are getting higher and higher. Following this trend, rigid-flex printed circuit boards will gradually become an important part of printed circuit boards. Rigid-flex board, as the name implies, is one or more rigid printed circuit boards, including one or more flexible printed circuit boards that are indispensable to form a whole. Its function reduces the use of connectors when assembling electronic products, greatly increasing It has the advantages of reliability, faster signal transmission, and smaller finished product size. [0003] The traditional production method of flexible and rigid boa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4691H05K1/0298H05K2201/0195
Inventor 华福德
Owner 高德(江苏)电子科技股份有限公司