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Preparation method for semiconductor electrothermal film

A semiconductor and electrothermal film technology, applied in electrothermal devices, ohmic resistance heating, electrical components, etc., can solve problems such as excessive temperature requirements and heavy metal pollution, and achieve the effect of overcoming excessive temperature requirements, protecting equipment, and working stably

Inactive Publication Date: 2017-05-03
徐荣俊
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] According to the above-mentioned defects, the object of the present invention is to provide a preparation method for conductive electrothermal film, which not only overcomes the problems of excessive temperature requirements and heavy metal pollution in the process of preparation or use, but also truly realizes mass production.

Method used

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Embodiment Construction

[0010] A preparation method for a semiconductor electrothermal film, comprising the following steps:

[0011] 1. Raw material preparation Add metal compounds, such as gold, silver, tin ----- or other organic compounds into 1%-10% by weight compounds, such as antimony, iron, fluorine as dopants;

[0012] 2. Material blending Mix the above-mentioned raw materials with 20%-60% medium materials, such as water, methanol, hydrochloric acid, ethanol, ethylamine, triethylamine;

[0013] 3. Substrate cleaning: The preformed component substrates that can be heated, such as quartz, glass, ceramics, and mica, are made of high-temperature-resistant and low-expansion materials, and the surface is cleaned with purified soft water and dried;

[0014] 4. High-temperature atomization growth Put the above-mentioned substrate into a high-temperature furnace to heat to activate its surface, and then atomize and spray the above-mentioned prepared fluid material into the high-temperature furnace to ...

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Abstract

The invention provides a preparation method for a semiconductor electrothermal film. The method comprises the following steps of (1) raw material modulation, namely adding metal compounds, such as a gold compound, a silver compound, a tin compound, ... or other organic compounds to a compound with the weight ratio of 1%-10% in the process; (2) material bending, namely mixing raw materials with 20%-60% of a dielectric material; (3) base material cleaning, namely preparing a preformed element base material which is used for emitting heat and made from high-temperature resistant low-expansion coefficient materials such as quartz, glass, ceramic and mica, cleaning the surface of the base material by using purified soft water and drying the surface; and (4) high-temperature atomized growth, putting the base material into a high temperature furnace chamber, heating the base material to activate the surface of the base material, spraying the demodulated fluid material into the high temperature furnace chamber in an atomized manner, forming ions with potential to evenly cover the surface of the base material and forming the semiconductor electrothermal film. The preparation method is convenient to operate and high in production efficiency, and can well meet the requirements of mass production.

Description

technical field [0001] The invention relates to the technical field of using glass as an electric heating element, in particular to a method for preparing a semiconductor electric heating film. Background technique [0002] Semiconductor electrothermal film technology belongs to a kind of electric heating technology, which is widely used in various fields such as industry and agriculture. International research on this field began in the 1940s, but it was relatively late in China. Patents and components related to electrothermal film technology began to appear in the 1980s. However, due to the lack of scientific and advanced methods and processes, its products have disadvantages such as poor stability, large attenuation, and limited working range. Common electric heating devices use metal resistance wires, which convert electric energy into electric heating energy due to resistance during operation. This kind of electric heating device has high production cost, large worki...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/26H05B3/12
CPCH05B3/265H05B3/12H05B2203/017
Inventor 徐荣俊
Owner 徐荣俊
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