Fabrication method of high-efficiency Q-LED package structure

A technology of packaging structure and manufacturing method, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as weak electroluminescence performance, Q-LED efficiency, life, processing technology and other comprehensive performance can not fully meet people's requirements and other problems , to achieve the effect of low production cost, ensuring light and color uniformity, and strong applicability

Inactive Publication Date: 2017-05-10
左洪波
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

At present, most of the research is on photoluminescence, and the research on electroluminescence performance is still relatively weak. The comprehensive performance of Q-LED in terms of efficiency, life and processing technology is far from fully meeting people's requirements.

Method used

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  • Fabrication method of high-efficiency Q-LED package structure
  • Fabrication method of high-efficiency Q-LED package structure

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Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0016] combine Figure 1-2 , the specific steps of this embodiment are: preparing quantum dot film layer: depositing a layer of parylene 2 on the substrate 1, arranging the quantum dot array 3 as required, coating the quantum dots on the substrate in turn, curing, and depositing again after curing One layer of parylene layer 11 seals the quantum dots between the two layers of parylene layers, and finally peels the film layer from the glass substrate to form the final quantum dot film layer; the transparent film coated with conductive metal electrodes at both ends The substrate 4 is coated with ultraviolet photosensitive adhesive, the quantum dot film layer 5 is cut into a suitable size according to the packaging requirements, and it is pasted on the substrate 4 with an automatic adhesive machine, and then cured; after the chip 6 is glued, it ...

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Abstract

The invention provides a fabrication method of a high-efficiency Q-LED package structure. A traditional fluorescent powder layer is substituted by a quantum dot adhesive layer, a chip group is connected and fixed between two layers of transparent substrate to form a sandwich structure, the whole sandwich structure is placed in an armor metal structure, an opening is formed in an upper part of the metal structure, light given out from chips can be given out through the upper part, and the chips at two ends are connected with the outside from a lower part of the metal structure through wires. The fabrication method is simple in technology process, high in production efficiency and low in cost; quantum dots are sealed between two Parylene functional film layers, so that the high-efficiency Q-LED package structure can be used for a long time and cannot be affected by water and air, and the limitation of an environment condition is reduced; and the quantum dots are coated in an adhesive film form, so that the thickness of an adhesive film can be enabled to be uniform, and the light color is more uniform.

Description

[0001] (1) Technical field [0002] The invention belongs to the technical field of LED packaging, and in particular relates to a method for manufacturing a high-efficiency Q-LED packaging structure. [0003] (2) Background technology [0004] Quantum dots are a kind of nanocrystals, which have the characteristics of high luminous efficiency, long service life and good color purity. The Q-LED display technology made of quantum dots can achieve close to continuous spectrum, high color rendering and better color The display characteristics can increase the brightness of the TV by 30~40%. Quantum dots are the basic material for Q-LEDs to emit light. There are two main ways to realize Q-LED light emission: one is to use GaN-based LED as a light conversion layer, which can effectively absorb blue light and emit various colors of light whose wavelength is precisely adjustable in the visible light range; the other is to use its electroluminescent form , which is coated between thin-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/502H01L33/505H01L2933/0041
Inventor 刘双良左洪波张学军
Owner 左洪波
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