Method for preparing low pollution and high uniformity PTFE copper clad laminate and PTFE copper clad laminate thereof

Abstract

The invention discloses a method for preparing low pollution and high uniformity PTFE copper clad laminate and a PTFE copper clad laminate thereof. The method consists of the preparation of adhesive tape and the preparation of dielectric layer billets. The preparation of adhesive tape comprises using polytetrafluoroethylene dispersing agent to process dipping and coating once on fiberglass cloth, and then, preparing single coating adhesive tape through drying and baking; the preparation of dielectric layer billets comprises preparing dielectric layer billets comprises by preliminary combining the single coating adhesive tape and the relevant PTFE membrane. The PTFE copper clad laminate comprises a dielectric layer. The dielectric layer comprises a single coating adhesive tape layer and a PTFE membrane layer. The method for preparing low pollution and high uniformity PTFE copper clad laminate and the PTFE copper clad laminate thereof can mitigate the environmental hazards of perfluorooctanoic acid ammonium and lower the energy consumption by significantly reducing the dosage of PTFE dispersing agent.

Description

technical field [0001] The invention relates to the technical field of CCL production, in particular to a method for preparing a low-pollution and high-uniformity PTFE copper-clad laminate and the PTFE copper-clad laminate. Background technique [0002] At present, PTFE copper clad laminate products are impregnated with PTFE dispersion liquid through glass cloth. According to different DK\DF index requirements of designed products, generally glass cloth needs to be glued 4 to 8 times (1 time of PTFE dispersion liquid dipping and 1 time of baking is 1 time of coating) glue process), that is, to control the proportion of PTFE in the medium layer to 65% to 97% (the rest is glass fiber). The PTFE dispersion is composed of about 60% solid PTFE powder and about 34% water under the action of about 6% perfluorooctanoic acid ammonium active agent to achieve suspension and dispersion. Volatilization and decomposition, ammonium perfluorooctanoate is highly toxic, and high temperature ...

AI Technical Summary

Problems solved by technology

The viscosity of PTFE dispersion is 0.015Pa·s~0.1020Pa·s. Because of its low viscosity, it will be combined with glass cloth during the impregnation process to cause severe vertical flow, and serious flow marks will be formed on the surface of the film. Very high, the melt viscosity decreases with the increase of shear stress, showing the characteristics of its non-Newtonian fluid, it is difficult to squeeze its flow marks flat, thus affecting the local content uniformity of the plate (affecting the uniformity of DK\DF properties ), and the dielectric layer and copper foil surface are clearly visible stripes corresponding to flow marks

And the existing PTFE copper-clad laminate production, the PTFE in the medium layer is all achieved by the cumulative method of PTFE dispersion gluing. On the one hand, about 6% of the perfluorooctanoic acid ammonium in the PTFE dispersion must be volatilized or decomposed, causing environmental pollution. Significant harm; on the other hand, the PTFE dispersion has been glued many times, because there are flow marks formed by the vertical flow of different dipping times on the surface of the adhesive tape, the uniformity of the local characteristics of the plate fluctuates greatly, and the color difference between the copper foil surface and the dielectric layer is obvious

[0003] In addition, in the existing production process, PTFE needs to be sintered during the gluing process, and the PTFE component needs to be sintered again during hot pressing

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