Elective etching solution of nickel or nickel alloy, and preparation method and application thereof

Abstract

The invention discloses elective etching solution of nickel or nickel alloy, and a preparation method and application thereof. The etching solution is prepared from the following ingredients in parts by weight: ferric trichloride, ferric trifluoroacetylacetonate, sulfamic acid, hexanedioic acid, gamma-3-aminopropyltriethoxysilane, potassium thiosulfate, hydrofluoric acid, imidazoline ammonium salt and deionized water. The etching solution provided by the invention has a proper etching speed for the nickel or nickel alloy, hardly corrodes copper, and is high in selectivity. In addition, an etched copper plate has a light surface, is free from sediments, is smooth and is free from lateral erosion.

Description

technical field [0001] The invention belongs to the field of metal surface chemical treatment, and in particular relates to a nickel or nickel alloy selective etching solution, a preparation method and application thereof. Background technique [0002] Etching is a technique that removes the surface of a material by chemical reaction or physical impact. Etching using etchant is a kind of chemical etching. When the material contacts the etching solution, the surface layer of the material and the newly formed surface layer are continuously dissolved and corroded by the etching solution, thus forming a concave-convex or hollowed-out three-dimensional effect. [0003] In the manufacturing process of the electrodes and wiring of the flexible substrate, there is a process of forming a nickel film by electroplating, and the unnecessary part of the nickel film can be peeled off through the etching solution. Since electrodes and wiring are often laminated with multiple metals, it i...

AI Technical Summary

Problems solved by technology

The etchant can etch nickel in a small amount, but the etching rate of nickel can hardly be controlled and is very low

Images