Elective etching solution of nickel or nickel alloy, and preparation method and application thereof

A nickel alloy and selective technology, which is applied in the field of nickel or nickel alloy selective etching solution and its preparation, can solve the problems such as uncontrollable nickel etching rate, and achieve the effect of bright surface, strong selectivity and appropriate etching speed

Active Publication Date: 2017-05-24
江苏和达电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The etchant can etch nickel in a small amount, but the etch

Method used

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  • Elective etching solution of nickel or nickel alloy, and preparation method and application thereof
  • Elective etching solution of nickel or nickel alloy, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10 and comparative example 3-6

[0031] Prepare the etching solution of Example 1-10 according to the parts by weight of Table 1, and its preparation method is as follows: by weight, hydrofluoric acid, adipic acid and sulfamic acid are successively dissolved in 1 / 6-1 / 4 amounts of deionized water, after mixing evenly, add ferric trichloride, iron trifluoroacetylacetonate, imidazoline quaternary ammonium salt in turn, let stand for 10-30min, add γ-aminopropyltriethoxysilane when using , potassium thiosulfate, glycerin and the rest of deionized water, stir evenly, and then use.

[0032] Table 1 embodiment 1-10 and comparative example 3-6 each component parts by weight

[0033]

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PUM

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Abstract

The invention discloses elective etching solution of nickel or nickel alloy, and a preparation method and application thereof. The etching solution is prepared from the following ingredients in parts by weight: ferric trichloride, ferric trifluoroacetylacetonate, sulfamic acid, hexanedioic acid, gamma-3-aminopropyltriethoxysilane, potassium thiosulfate, hydrofluoric acid, imidazoline ammonium salt and deionized water. The etching solution provided by the invention has a proper etching speed for the nickel or nickel alloy, hardly corrodes copper, and is high in selectivity. In addition, an etched copper plate has a light surface, is free from sediments, is smooth and is free from lateral erosion.

Description

technical field [0001] The invention belongs to the field of metal surface chemical treatment, and in particular relates to a nickel or nickel alloy selective etching solution, a preparation method and application thereof. Background technique [0002] Etching is a technique that removes the surface of a material by chemical reaction or physical impact. Etching using etchant is a kind of chemical etching. When the material contacts the etching solution, the surface layer of the material and the newly formed surface layer are continuously dissolved and corroded by the etching solution, thus forming a concave-convex or hollowed-out three-dimensional effect. [0003] In the manufacturing process of the electrodes and wiring of the flexible substrate, there is a process of forming a nickel film by electroplating, and the unnecessary part of the nickel film can be peeled off through the etching solution. Since electrodes and wiring are often laminated with multiple metals, it i...

Claims

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Application Information

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IPC IPC(8): C23F1/44
CPCC23F1/44
Inventor 王毅明朱霞
Owner 江苏和达电子科技有限公司
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