Lifting dispensing device for ceramic substrate

Abstract

The invention discloses a lifting dispensing device for a ceramic substrate. The device comprises a lifting mechanism, a positioning mechanism, a dispensing mechanism and a control mechanism, wherein the lifting mechanism is located in an operating space of the positioning mechanism, the dispensing mechanism is located on the lower portion of the lifting mechanism, and the control mechanism is located on the upper portion of the lifting mechanism; the lifting mechanism, the positioning mechanism and the dispensing mechanism are electrically connected to the control mechanism; the lifting mechanism comprises a mounting plate, a lifting arm is fixedly arranged in the center of the mounting plate, a rotating arm sleeves the lower end of the lifting arm, a rotating motor is arranged on the rotating arm, and the lower end of the rotating arm is fixedly connected to a fixed plate; lifting air cylinders are also arranged on two sides of the mounting plate, and the lower ends of the lifting air cylinders are fixedly connected through a connecting plate. The dispensing device disclosed by the invention integrates positioning and dispensing functions, lifts, positions and dispenses the ceramic substrate, is relatively high in self coordination, not only saves the occupied space, but also quickly dispenses, and has the advantages of being space-saving, easy to operate, high in flexibility and the like.

Description

[0001] Technical field: [0002] The invention relates to the technical field of dispensing equipment for ceramic substrates, in particular to a lifting and dispensing device for ceramic substrates. [0003] Background technique: [0004] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. The advent of ceramic substrate products opened the development of the heat dissipation application industry. Due to the heat dissipation charac...

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Problems solved by technology

[0005] When the ceramic substrate is processed into other LED products, it needs to go through the dispensing process. The current dispensing machine has low operating flexibility, and the dispensing machine and the positioning device are set separately, which takes up a lot of space and has low coordination. It is difficult to meet the requirements of saving space, Easy to operate, flexible use requirements

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