Tension control system

A technology of tension control and tension controller, which is applied in the direction of conveying filamentous materials, thin material processing, transportation and packaging, etc. It can solve the problems that the control method is not flexible enough, not perfect and convenient, and does not involve tension partition, etc., to achieve Easy operation, flexible control and simple effects

Active Publication Date: 2017-05-31
武汉新创元半导体有限公司
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AI Technical Summary

Problems solved by technology

First, its control method for the servo motor of the winding shaft is exactly the same as that of the servo motor for the unwinding shaft, so its control method is not flexible enough
Second, it does not address the tension control of the substrate in the plating tank of the plating apparatus
Third, it does not involve the tension partition between the unwinding section and the electroplating section of the electroplating device, nor does it involve the tension partition between the winding section and the electroplating section of the electroplating device
Fourth, it is still not perfect and convenient in some control details

Method used

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Embodiment Construction

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be understood by those skilled in the art that these descriptions only illustrate exemplary embodiments of the present invention, and are not intended to limit the protection scope of the present invention. For example, elements or features described in one figure or embodiment of the invention may be combined with other elements or features shown in one or more other figures or embodiments.

[0038] Please refer to figure 2 , which shows a schematic diagram of an electroplating apparatus 100 according to an embodiment of the present invention. The electroplating device 100 mainly includes an unwinding section 1 , an electroplating section 3 and a winding section 5 . The unwinding section 1 includes an unwinding shaft 11 and an unwinding tension sensor 12, and the unwinding shaft 11 can be connected with an unwinding servo motor. The electroplating...

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Abstract

The invention provides a tension control system. The tension control system aims to solve the problem that in the prior art, tension control systems are not flexible enough in control mode. The tension control system comprises an unwinding section control part, and electroplating section control part and a winding section control part, wherein the unwinding section control part is arranged for unwinding a flexible substrate with constant tension by controlling the tension of the flexible substrate in an unwinding section; the electroplating section control part is arranged for controlling the tension of the flexible substrate in an electroplating section; and the winding section control part is arranged for winding the flexible substrate in a winding section with constant moment. According to the tension control system, the fact that the radius of the volume flexible substrate in the winding section changes slightly is considered, so that the winding section control part is arranged for winding the flexible substrate in the winding section with constant moment, and the control modes of the tension control system are flexible and simple.

Description

technical field [0001] The invention relates to a tension control system, in particular to a segmented tension control system used in a production line for continuous electroplating of flexible substrates that can be wound. Background technique [0002] In recent years, metal-clad substrates (eg, metal-clad polyimide substrates) have been widely used to make thinner and thinner flexible circuit boards. [0003] When manufacturing the above-mentioned metal-clad base material, as a method of forming a metal layer on the surface of the base material, for example, a metal thin layer comprising nickel, chromium, nickel-chromium alloy, etc. may be first formed by sputtering, and then the metal thin layer A metal layer such as a copper layer is formed on the metal layer so that the metal layer has good electrical conductivity. Generally, a metal conductive layer such as copper can be formed on the substrate by electroplating the substrate with an electroplating device. [0004] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65H59/38B65H59/40
CPCB65H59/385B65H59/387B65H59/388B65H59/40B65H2701/1133B65H2701/1752
Inventor 潘登马邦科郭久林
Owner 武汉新创元半导体有限公司
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