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Heat-conductivity scanning system based on pumping-detection heat reflection technology

A scanning system and thermal conductivity technology, which is applied in the field of thermal conductivity testing, can solve the problems of not being able to satisfy the thermal conductivity distribution and not being able to obtain the thermal conductivity distribution of the sample surface.

Pending Publication Date: 2017-05-31
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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Problems solved by technology

In the traditional ultrashort laser pulse pumping detection system, only the thermal conductivity of an independent position on the sample surface can be measured, but the thermal conductivity distribution within the specified range of the sample surface cannot be obtained, which makes the traditional measurement system unable to meet the needs of microelectronics, optoelectronics, etc. The field requires a large number of thermal conductivity distributions on the surface of samples with microstructures within a specified range

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  • Heat-conductivity scanning system based on pumping-detection heat reflection technology

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Embodiment Construction

[0024] The technical idea of ​​the thermal conductivity scanning system based on the pumping detection heat reflection technology provided by the present invention is: the computer controls the three-dimensional electric mobile platform to move up, down, left, and right in two dimensions perpendicular to the incident direction of the laser beam. The current position information and conduct a pumping detection measurement, the lock-in amplifier collects the pumping detection signal output by the photodetector in real time, the computer obtains the output signal of the lock-in amplifier in real time, and the computer extracts the amplitude signal component of the lock-in amplifier output signal, and simultaneously controls the The three-dimensional electric moving table moves back and forth in the direction parallel to the incident laser beam, and stops when the amplitude signal component is maximum. This process is carried out before each pumping detection measurement.

[0025] ...

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Abstract

The invention provides a heat-conductivity scanning system based on a pumping-detection heat reflection technology. The heat-conductivity scanning system is characterized in that laser emitted from a pulse laser passes through a first 1 / 2 wave plate and then is divided into two beams by a first polarized splitting prism; a laser beam I is continuously transmitted by the first polarized splitting prism, and passes through a laser frequency-doubling module, a short-wave-pass light filter, a laser modulator and a short-wave reflection mirror in sequence to reach a cold light mirror, wherein the laser modulator is connected with a signal generator; a laser beam II passes through a long-wave reflection mirror, a right-angled reflection mirror, a second 1 / 2 wave plate, a second polarized splitting prism and a 1 / 4 wave plate in sequence to reach the cold light mirror; the laser beam I and the laser beam II are converged and then reach a sample fixing frame through an objective, wherein the sample fixing frame is fixed on a three-dimensional electric moving platform which is connected with a servo motor controller; and the laser beam II is reflected by a sample, passes through the objective lens, the cold light mirror, the 1 / 4 light filter and the second polarized splitting prism and then is focused to a photoelectric detector by a convex lens.

Description

technical field [0001] The invention belongs to the technical field of thermal conductivity testing, and mainly relates to ultrashort laser pulse pumping detection technology, in particular to a thermal conductivity scanning system based on pumping detection heat reflection technology. Background technique [0002] Micro-nano structure materials have been widely used in microelectronics, optoelectronics and other fields, and these microdevices will generate extremely high heat flux density during operation, and heat accumulation will directly affect the working efficiency and reliability of such devices. It is extremely urgent to solve the heat dissipation problem of the above-mentioned micro-devices, which requires accurate characterization of the heat transport properties of the micro-nano structure materials that make up the above-mentioned micro-devices in order to reveal its heat transport mechanism. In the study of ultrafast thermodynamic processes, it is often necessa...

Claims

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Application Information

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IPC IPC(8): G01N21/17G01N25/20
CPCG01N21/171G01N25/20
Inventor 孙方远赵勇唐大伟陈哲王新伟杨明
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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