A method for detecting defects in electronic die-cutting materials based on machine vision
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HANGZHOU BYTE INFORMATION TECH CO LTD
- Publication Date
- 2019-04-16
Abstract
Description
technical field
[0001] The invention relates to a method for realizing defect detection of electronic die cutting material based on machine vision. Background technique
[0002] With the subversive development of industrial Internet, sensor technology and new generation of information technology, the world's major manufacturing powers are competing to launch their smart manufacturing or industrial Internet strategies, representative ones are: the United States' advanced manufacturing strategy; Germany's Industry 4.0 ; Made in China 2025. Through technologies such as the Internet of Things, the Internet, big data, cloud computing, and broadband networks, and through access to sensors, information perception, network communication, remote control, and collaboration of physical equipment are realized, and industrial data flow interaction and hardware / software interaction are realized. Intelligent communication and security control. With the in-depth development of automation ...