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Bonding method for support pad of large-aperture reflecting mirror

A technology of large-diameter mirrors and support pads, used in installation, optics, instruments, etc., can solve the problems of unadjustable mirror position, uncontrollable thickness of the adhesive layer, and inability to place the mirror correctly, so that the thickness of the adhesive layer can be controlled. , The position accuracy and bond strength are satisfied, and the position accuracy is adjustable and controllable.

Inactive Publication Date: 2017-05-31
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] In order to solve the problems existing in the existing bonding method that the position of the reflector cannot be placed correctly at one time, the position of the reflector cannot be adjusted, and the thickness of the adhesive layer is uncontrollable, the present invention provides a bonding method for the support pad of the large-diameter reflector

Method used

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  • Bonding method for support pad of large-aperture reflecting mirror

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Embodiment Construction

[0033] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0034] In the present invention, the required tools and materials mainly include laser tracker, fishing line, scotch tape, hot melt glue, hot melt glue gun, hot blower, marker pen, 3M DP-2216, glue gun, rubber mixing tube, needle tube, A piece of rubber tube for static point, 240 sandpaper, rubber gloves, scissors, methylene chloride, acetone, ethanol, deionized water, dropper, absorbent paper, plastic wrap, etc.

[0035] Such as figure 1 Shown, the bonding method of large-aperture reflector support pad of the present invention, its specific process is as follows:

[0036] Step 1. Rough positioning

[0037] Preliminary determination of the position of each support pad 3 on the mirror 2 by the laser tracker: place the laser tracker at an appropriate position, establish a coordinate system relative to the mirror 2, and place the target ball of the laser track...

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Abstract

The invention provides a bonding method for a support pad of a large-aperture reflecting mirror, relates to the field of large-aperture reflecting mirrors and solves the problems that the reflecting mirror cannot be correctly placed once, the position of the reflecting mirror cannot be adjusted and glue thickness is uncontrollable with a conventional bonding way. According to the method, the position of the support pad is determined by a laser tracker, a fish tape is inserted between the support pad and the reflecting mirror to determine the thickness of a glue layer, glue mixed by a glue gun is smeared uniformly to the support pad, then the position of the support pad is adjusted by a positioning tool until requirements are met, the support pad is left to stand for a week, the positioning tool is removed after glue curing, and bonding of the support pad is completed. The position precision of the support pad is adjustable and controllable, the thickness of the glue layer is controllable, the bonding is firm, the position precision and the bonding strength both meet use requirements, and the method can be applied to bonding and fixing of the support pads on the back and side surface of any large-aperture reflecting mirror.

Description

technical field [0001] The invention relates to the technical field of large-diameter reflectors, in particular to a bonding method for supporting pads of large-diameter reflectors. Background technique [0002] When the diameter of the mirror is small, the peripheral support or central support is generally used to meet the requirements of the mirror surface shape. However, when the diameter of the reflector increases, the weight of the reflector can reach hundreds of kilograms or even more than one ton. At this time, multiple points of support on the back and side are required. Support pads connect the mirrors to the complex support structure. The bonding of the support pad must not only ensure the correct bonding position and sufficient bonding strength, but also ensure that no additional bonding stress will be generated. During the bonding process, the roughness and cleanliness of the bonding surface, the thickness of the adhesive layer, Factors such as the choice of gl...

Claims

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Application Information

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IPC IPC(8): G02B7/183G02B7/198
CPCG02B7/183
Inventor 王富国乔兵刘祥意韩西达
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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