Manufacturing method of substrate for display panel and manufacturing method of mn-doped zns quantum dots
A technology for display panels and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as difficult economical application, increased process difficulty, fluorescence quenching effect, etc., so as to improve display effect and enhance The effect of glow quality
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no. 1 example
[0021] see figure 1 , the first embodiment of the manufacturing method of the display panel substrate of the present invention includes:
[0022] S110, preparing a transparent substrate;
[0023] Wherein, the transparent substrate may specifically be at least one of glass, transparent silicon wafer, or transparent plastic.
[0024] S120, forming a color-resisting layer of Mn-doped ZnS quantum dot light emitter on the transparent substrate.
[0025] Specifically, the Mn-doped ZnS quantum dot dilute solution is coated on the transparent substrate by spin coating, and the rotating machine equipped with the transparent substrate starts to rotate from slow to fast, and the solution on the bottom plate is coated by centrifugal force. A thin film with a thickness ranging from microns to nanometers; then exposure, development, washing, baking and other processes are performed to form the above-mentioned color resist layer. In some application scenarios, the quantum dot luminous bod...
no. 2 example
[0027] see Figure 2 to Figure 9 , the second embodiment of the method for manufacturing a substrate for a display panel of the present invention includes:
[0028] S210, preparing a transparent substrate 41;
[0029] S220, forming a thin film transistor layer 42 on the transparent substrate 41 .
[0030] Specifically, forming the TFT layer 42 on the transparent substrate 41 includes: sequentially forming a first metal layer, a gate insulating layer, an active layer, an ohmic contact layer, a second metal layer, and a first passivation layer on the transparent substrate. .
[0031] Wherein, the first metal layer, that is, the gate layer, is specifically deposited on the transparent substrate 41 by metal sputtering, and then photoresist coating, exposure, development, etching, and photoresist stripping are performed to form a predetermined pattern. The first metal layer, the gate layer. Specifically, the first metal layer may be a single metal layer or a composite metal lay...
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