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Heat pipe sealing method

A sealing and heat pipe technology, applied in heat exchange equipment, forming tools, manufacturing tools, etc., can solve problems such as smooth necking end, low yield rate, complicated process, etc., to achieve convenient direct welding and sealing, improve product performance, The effect of simplifying the processing technology

Inactive Publication Date: 2017-06-06
AAC TECH PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For pipes with a wall thickness of 0.08mm, the necking process is difficult to ensure that the necking end is smooth, and the actual yield is lower than 80%, resulting in waste of materials; at the same time, because the necking section needs to occupy the length of the heat pipe, the length of the ineffective end will be increased
The large "U"-shaped seal reduces the necking process, but the welding width is the largest, and the solder joints will only be formed at a certain position in the large "U" shape, which is very easy to cause leakage. In order to ensure the welding effect, the process needs to be adjusted. Multiple times of shaping and welding are used to gradually compress the large "U"-shaped mouth and repeated welding, resulting in more and more complicated processes; in order to solve the leakage problem of the large "U"-shaped seal, the small "U"-shaped seal should be used Its integrated necking process and large "U" shaped mouth have become the most widely used structure in the industry, but as the thickness of the pipe wall becomes thinner, the shrinking pipe of the pipe with a wall thickness of 0.08mm becomes a bottleneck, making this method The production yield rate cannot exceed 80%, and it still cannot effectively shorten the length of the invalid end

Method used

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. . Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] see figure 1 , is a schematic structural diagram of the sealing mold provided by the present invention. The sealing mold 3 includes two first molds 31 and two second molds 32 , wherein the two first molds 31 are disposed opposite to each other, and the two second molds 32 are disposed opposite to each other.

[0033] The first mold 31 includes a first body 311 , a first extrusion end 313 disposed at one end of the first bo...

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Abstract

The invention provides a heat pipe sealing method. The heat pipe sealing method comprises the following steps that a to-be-sealed heat pipe and a sealing mould are provided, and the sealing mould is installed to enable the sealing mould to be arranged at the end of the to-be-sealed heat pipe in a surrounding mode; the sealing mould extrudes the end of the to-be-sealed heat pipe to form a sealed opening; and the sealed opening is welded, and a finished heat pipe is formed. Compared with the prior art, the heat pipe sealing method solves the technical problems that a machining technique of the heat pipe is complex, the length of an invalid end is too long, and the yield of sealing of the ultrathin heat pipe is low.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of heat dissipation of electronic products, in particular to a sealing method of a heat pipe used for heat dissipation of electronic products. [0003] 【Background technique】 [0004] With the rapid development of electronic technology, the integration of electronic products is getting higher and higher, and the accompanying thermal effect is becoming more and more serious, which has a serious impact on the reliability of electronic products, such as: affecting the reliability of machinery (solder joint failure, DIE Fracture, accelerated corrosion); affect electrical reliability (resulting in electrical overload overload, electron migration, gate oxidation failure, parameter shift caused by ion diffusion); affect device performance (signal deterioration). [0005] In order to strengthen the heat dissipation of electronic products, realize heat transfer in time, eliminate hot spots, utilize energy efficiently, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26B21D41/04B21D37/10B21D53/06B23K20/10
CPCB23P15/26B21D37/10B21D41/04B21D53/06B23K20/10
Inventor 代升亮申广兵
Owner AAC TECH PTE LTD