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Photon chip temperature control structure based on TEC

A photonic chip and substrate technology, applied in the field of photonic chip temperature control structure, to achieve the effect of solving temperature drift, small size, and improving efficiency

Active Publication Date: 2017-06-09
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through the method of integrating TEC and photonic chip with this structure, the problem of temperature drift in thermal modulation of photonic chip is solved, and the efficiency of thermal coupling and packaging of the photonic chip is greatly improved

Method used

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  • Photon chip temperature control structure based on TEC
  • Photon chip temperature control structure based on TEC
  • Photon chip temperature control structure based on TEC

Examples

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Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] Such as figure 1 , 2 , 3, 4, and 5 are schematic diagrams of the TEC-based photonic chip temperature control structure provided by the preferred embodiment of the present invention. A TEC-based photonic chip temperature control structure, including a temperature control target photonic chip 1, a PCB substrate 2 for leading out the thermal adjustment electrode of the photonic chip 1, and a heat conducting plate 3, the heat conducting plate 3 is provided with a heat conducting boss 4, The photonic chip 1 is bonded on the heat-conducting boss 4 by heat-conducting silver glue; the PCB substrat...

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Abstract

The invention relates to a TEC temperature control structure, and especially relates to a photon chip temperature control structure based on a TEC; the photon chip temperature control structure comprises a temperature control object photon chip, a PCB substrate used for leading out a photon chip thermal adjusting electrode and a heat conductive plate; the heat conductive plate is provided with a heat conductive platform; the photon chip is bonded on the heat conductive platform; the PCB substrate is provided with a through hole; the photon chip extrudes outside the top surface of the PCB substrate, and the photon chip thermal adjusting electrode is led to the PCB substrate; the heat conductive plate bottom is attached to the cold end of a TEC refrigeration piece; the hot end of the TEC refrigeration piece is attached on the top end face of a heat radiation pedestal; a hole is opened on the side wall of the heat conductive plate and positioned right below the heat conductive platform, a NTC temperature sensor is arranged in the hole. The TEC and the photon chip are integrated so as to solve the photon chip thermal modulation temperature drift problems, thus greatly improving the thermal modulation coupling and packing efficiency of the photon chip; the photon chip temperature control structure is small in size, compact in structure, high in efficiency and high in integration level.

Description

technical field [0001] The invention relates to a TEC temperature control structure, in particular to a TEC-based photonic chip temperature control structure. Background technique [0002] The semiconductor refrigerator TEC is made by using the Peltier effect of semiconductor materials. The so-called Peltier effect refers to the phenomenon that when direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. . The TEC-based temperature control scheme has the advantages of small size and easy control, and has a wide range of applications in the semiconductor field. [0003] Silicon-based photonics has been greatly developed in recent years. Because the manufacturing process of silicon-based integrated optical devices is fully compatible with microelectronics processes; and the carrier light wave transmitted in the photonic chip is a kind of electromagnetic wave with extremely high frequency, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/122
CPCG02B6/122G02B2006/12135Y02D10/00
Inventor 赵恒崔乃迪金里方俏然冯俊波周杰
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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