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High-speed diamond grinding wheel and preparation method thereof

A diamond grinding wheel and diamond technology, applied in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of low grinding efficiency, short service life, and low processing accuracy of grinding wheels, and achieve easy use and promotion, Reduced processing costs and high processing efficiency

Inactive Publication Date: 2017-06-13
台山市兰宝磨具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In ceramic and stone processing occasions, ordinary silicon carbide grinding wheels are commonly used for processing. The grinding wheels of this material are cheap and the technology is relatively mature, but there are also many disadvantages, such as high temperature is easy to produce black cores, short service life, and low processing accuracy. , more energy consumption, etc.
In recent years, diamond grinding wheels have gradually begun to replace silicon carbide grinding wheels, and resin-bonded grinding wheels are generally made of diamond grinding wheels, but the grinding efficiency of resin-bonded grinding wheels is low, and deformation is easy to occur during the grinding process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A high-speed diamond grinding wheel includes a base body and grinding blocks, and the grinding blocks cover the base body. The grinding block is composed of 37% diamond abrasive, 45% corundum and 18% vitrified bond.

[0016] The raw material composition of the vitrified bond and its weight percent content are: SiO 2 40%, Al 2 o 3 15%, B 2 o 3 20%, Li 2 O 10%, Na 2 O 8%, K 2 O 7%.

[0017] The base material used is alloy steel.

[0018] The particle size of the diamond abrasive is 100 mesh.

[0019] The preparation method of the high-speed diamond grinding wheel of the present invention comprises the following steps:

[0020] Step 1: Add vitrified bond, diamond abrasive, and corundum into the mixer and mix evenly before granulating. Put the grinding wheel mixture into the mold evenly and evenly, and press it at 250°C with a predetermined pressure of 20MPa, and keep the pressure for 2 hours. , and then put the formed green body into a sintering furnace and sint...

Embodiment 2

[0023] A high-speed diamond grinding wheel includes a base body and grinding blocks, and the grinding blocks cover the base body. The grinding block is composed of 37% diamond abrasive, 45% corundum and 18% vitrified bond.

[0024] The raw material composition and weight percentage content of vitrified bond are: SiO 2 45%, Al 2 o 3 10%, B 2 o 3 20%, Li 2 O 10%, Na 2 O 8%, K 2 O 7%.

[0025] The base material used is alloy steel.

[0026] The particle size of the diamond abrasive is 230 mesh.

[0027] The preparation method of the high-speed diamond grinding wheel of the present invention comprises the following steps:

[0028] Step 1: Add vitrified bond, diamond abrasive, and corundum into the mixer and mix evenly before granulating. Put the grinding wheel mixture into the mold evenly and evenly, and press it at 250°C with a predetermined pressure of 20MPa, and keep the pressure for 2 hours. , and then put the formed green body into the sintering furnace and sinter ...

Embodiment 3

[0031] A high-speed diamond grinding wheel includes a base body and grinding blocks, and the grinding blocks cover the base body. The grinding block is composed of 50% diamond abrasive, 30% corundum and 20% vitrified bond.

[0032] The raw material composition and weight percentage content of vitrified bond are: SiO 2 43%, Al 2 o 3 12%, B 2 o 3 20%, Li 2 O 9%, Na 2 O 7%, K 2 O 9%. .

[0033] The base material used is alloy steel.

[0034] The particle size of the diamond abrasive is 270 mesh.

[0035] The preparation method of the high-speed diamond grinding wheel of the present invention comprises the following steps:

[0036] Step 1: Add vitrified bond, diamond abrasive, and corundum into the mixer and mix evenly before granulating. Put the grinding wheel mixture into the mold evenly and evenly, and press it at 250°C with a predetermined pressure of 20MPa, and keep the pressure for 2 hours. , and then put the formed green body into the sintering furnace and sinte...

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Abstract

The invention discloses a high-speed diamond grinding wheel. The high-speed diamond grinding wheel comprises a substrate and a grinding block. The grinding block covers the substrate and is composed of, by mass, 37-55% of a diamond grinding material, 30-45% of corundum and 18-30% of a ceramic bond. Raw materials of the ceramic bond comprise, by weight, 40-45% of SiO2, 10-15% of Al2O3, 18-20% of B2O3, 9-10% of Li2O, 7-8% of Na2O and 7-9% of K2O. The firing temperature of the bond is 750-820 DEG C, the pullout strength to the grinding material is high, damage of adopted diamond is greatly reduced under the designed technological system, and the grinding wheel does not need to be trimmed in the grinding process.

Description

technical field [0001] The invention relates to the field of grinding tools, in particular to a high-speed diamond grinding wheel and a preparation method thereof. Background technique [0002] In ceramic and stone processing occasions, ordinary silicon carbide grinding wheels are commonly used for processing. The grinding wheels of this material are cheap and the technology is relatively mature, but there are also many disadvantages, such as high temperature is easy to produce black cores, short service life, and low processing accuracy. , and more energy consumption. In recent years, diamond grinding wheels have gradually begun to replace silicon carbide grinding wheels, and resin-bonded grinding wheels are commonly used to make diamond grinding wheels. However, resin-bonded grinding wheels have low grinding efficiency and are prone to deformation during the grinding process. Contents of the invention [0003] The purpose of the present invention is to overcome the shor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/14B24D3/34B24D18/00
CPCB24D3/14B24D3/342B24D18/0009B24D18/0072
Inventor 陈德庆
Owner 台山市兰宝磨具有限公司
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