Adjustable Insoluble Anode Plate And Method Applied To Copper Cylinder Plating

Abstract

The invention provides an adjustable insoluble anode plate and a method applied to copper cylinder plating. The adjustable insoluble anode plate is applied to a copper cylinder plating process. The process comprises the following components: an anode plate, a power supply and a controller; wherein the anode plate also comprises the following components: a plate, which is prepared by a material with resistance to acid and base; a plurality of metal columns, which are embeded in the plate in an arrangement, wherein one end face of each metal column is exposed to the surface of the plate, in order to contact electroplating liquid used in an electroplating process, and the other end is connected to the power supply by a wire; the controller is connected to the power supply in order to control the supply current of the power supply for each metal column. The area and the shape of the current can be changed, and output current at different positions can be changed at the same time, so that different positions of the insoluble anode plate are provided with single point of on / off or different output current sizes.

Description

Technical field [0001] The present disclosure relates to a controllable insoluble anode plate, in particular to a copper pillar electroplating process and method. Background technique [0002] Copper pillar bump technology is a technology that has been gradually adopted in three-dimensional integrated circuit (3D IC) technology in recent years, and has also emerged in various application fields. Because the copper pillars can be made by electroplating; therefore, the copper pillar electroplating system has become a common process application system in the 3D IC industry. Generally, in the process of the 3D IC industry, copper pillars are usually formed on a patterned silicon substrate or a printed circuit board (PCB) by electroplating. In the process of electroplating, the most important thing is to make the copper pillars formed by electroplating have uniformity. Therefore, how to electroplate copper pillars with high uniformity is one of the most important performance indicato...

AI Technical Summary

Problems solved by technology

[0004] The above two different anode plate structures are for the uniform distribution of the electric field in the solution during electroplating, so that the height of the copper pillars after electroplating can be uniform; however, according to the practical results, the uniformity is generally bad

Because in the existing copper column electroplating equipment, unless the design of the anode plate is changed, the shape of the anode plate is fixed, so the existing technology often uses an additional anode shroud to improve the uniformity of the height of the copper column. However, in the process, the pattern and shielding range of the anode shield are often changed due to the different patterns of the cathode Si substrate or PCB board, which will only increase the inconvenience and reduce the efficiency of the experiment or mass production line.

Therefore, although the use of the anode shroud can indeed improve the situation of poor uniformity, there are still limitations

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