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Optimum structural design method for electronic equipment

An electronic equipment and optimization design technology, which is applied in the field of structural optimization design of high-density and complex airborne chassis electronic equipment, can solve problems such as lack of applicability, and achieve the effects of reducing excessive temperature, good heat conduction mode, and strong practicability

Active Publication Date: 2017-06-20
XIDIAN UNIV
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Problems solved by technology

Not yet widely applicable
In addition, few scholars have done systematic research on the multi-field coupling problem of electronic equipment chassis structure

Method used

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  • Optimum structural design method for electronic equipment
  • Optimum structural design method for electronic equipment
  • Optimum structural design method for electronic equipment

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Embodiment Construction

[0041] The invention will be further described in detail below in conjunction with the accompanying drawings and embodiments, but it is not used as a basis for any limitation on the invention.

[0042] Such as figure 1 As shown, the electronic equipment structure optimization design method of the present invention includes the following steps:

[0043] (1) According to the structural parameters and dimensions of the electronic equipment, use the three-dimensional modeling software pro / e to establish the electronic equipment model; The flow rate of the liquid.

[0044] (2) Use the Workbench analysis software to read the established electronic equipment model, and use the Geometry module in the Workbench analysis software to remodel the structural parameters of the electronic equipment model, and use the sequence secondary optimization algorithm provided by the ISIGHT optimization software to perform structural optimization. The parameters are optimized to obtain the optimized...

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Abstract

The invention discloses an optimum structural design method for electronic equipment. The method comprises the following steps: using three-dimensional model software pro / e for establishing an electronic equipment model; using Workbench analysis software for remodeling a structure parameter of the electronic equipment model, thereby acquiring an optimized structure parameter; performing thermal simulation analysis on an optimizing model in Icepak thermal simulation software, thereby acquiring a working temperature of the electronic equipment; applying the working temperature to an optimizing model structure for performing thermal-structure coupling simulation analysis in static structure simulation software, thereby acquiring structure thermal deformation of the electronic equipment; establishing a mathematical optimization model of the electronic equipment and judging the working temperature and the structure thermal deformation f of the electronic equipment, thereby confirming the design reasonability of the electronic equipment with such a structure. The method provided by the invention can be used for guiding the design for chassis under mutual influence of structure-thermal two fields and prolonging the service life of the chassis; the optimizing result is more accurate; the performance stability of the chassis under a severe service environment can be guaranteed.

Description

technical field [0001] The invention belongs to the field of electronic equipment, and in particular relates to a structural optimization design method for high-density and complex airborne chassis electronic equipment. Background technique [0002] The chassis of electronic equipment is a basic structure that assembles various electronic components or mechanical parts inside the equipment into a whole, exempts it from the influence and interference of various complex environments, and ensures electrical performance. As the chassis of modern military electronic equipment used in high-tech products, it must not only meet the functional requirements of the equipment, but also meet the environmental requirements of the equipment. A well-designed electronic chassis can make the equipment withstand strong vibration shock, electromagnetic interference and relatively harsh weather conditions, which is the basis for improving the reliability of modern electronic equipment. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/13G06F30/20G06F2111/10
Inventor 王伟孟鹏飞王国创王从思钱思浩张烁李鹏陈竹梅杨文芳张敬莹
Owner XIDIAN UNIV
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