Press ring and semiconductor processing device

Abstract

The invention provides a press ring and a semiconductor processing device. The press ring includes an outer ring part and an inner ring part nested each other and connected integrally, wherein the inner diameter of the outer ring part is greater than the diameter of a wafer. The inner diameter of the inner ring part is smaller than the diameter of the wafer. The lower surface of the inner ring part is divided into a plurality of first areas and second areas distributed in an alternating manner along the peripheral direction of the inner ring part. The first areas fit the marginal area of the upper surface of the wafer. Grooves are formed in the second areas so as to enable the inner ring part to shield the marginal area of the upper surface of the wafer at the second areas and to be not in contact with the marginal area. According to the invention, a problem of metal coating settlement on the side face or the back face of the wafer can be solved and a technical result is thus improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a pressure ring and semiconductor processing equipment. Background technique [0002] In the manufacturing process of integrated circuits, physical vapor deposition (Physical Vapor Deposition, hereinafter referred to as PVD) technology is usually used to deposit materials such as metal layers on wafers. With the widespread application of Through Silicon Via (TSV) technology, PVD technology is mainly used to deposit barrier layers and copper seed layers in the through silicon vias. During the TSV deposition process, a clamp ring is usually used to fix the wafer. [0003] figure 1 It is a top view of the existing pressure ring after fixing the wafer. see figure 1 , the pressure ring includes an annular body 1 , and a plurality of pressure jaws 3 are arranged on the inner peripheral wall of the annular body 1 , and the plurality of pressure jaws 3 are spaced and evenly...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a pressure ring and semiconductor processing equipment, which can solve the problem of metal coating deposited on the side or back of the wafer, thereby improving the process results

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