A high-resolution detection and identification method for debonding defects in composite materials

A composite material and high-resolution technology, applied in character and pattern recognition, instruments, computing, etc., can solve problems such as low resolution, blurred edges, noise interference, etc., and achieve the effect of improving resolution, improving contrast, and improving accuracy

Active Publication Date: 2019-11-19
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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AI Technical Summary

Problems solved by technology

[0003] However, the image obtained by the optical excitation infrared thermal imaging system is affected by the thermal imager and the lateral thermal diffusion of the composite material, and has the disadvantages of low resolution, blurred edges, and noise interference. In order to improve the accuracy and efficiency of defect detection, many feature extraction Algorithms are used to extract image defect information, such as thermal imaging signal reconstruction (TSR), principal component analysis (PCA) and pulse phase thermal imaging (PPT), etc.

Method used

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  • A high-resolution detection and identification method for debonding defects in composite materials
  • A high-resolution detection and identification method for debonding defects in composite materials
  • A high-resolution detection and identification method for debonding defects in composite materials

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Embodiment

[0023] figure 1 It is a flowchart of a high-resolution detection and identification method for debonding defects of composite materials in the present invention.

[0024] In this example, if figure 1 As shown, a kind of high-resolution detection and identification method to composite material debonding defect of the present invention comprises the following steps:

[0025] S1, preprocessing

[0026] When the test piece is excited by the heat source, in the process of thermal equilibrium, part of the defect information can be displayed in the infrared thermal image, and the physical characteristics of the surface temperature field changing with time and space can be expressed by known mathematical models. When performing theoretical analysis, the temperature change of each pixel point can be simplified into a one-dimensional heat conduction model, and post-processing analysis is performed on this basis. The mathematical model of the surface temperature of the specimen can be ...

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Abstract

The invention discloses a high-resolution detection and identification method for debonding defects of composite materials. Under the action of a light-excited infrared thermal imaging system, a sample containing defects has different thermal diffusion and thermal radiation characteristics in different regions of the material. There is a high-temperature area at the defect, and the surface temperature field collected by the thermal imager can reflect certain defect information with time and space, and provide information for the later feature extraction algorithm, and then based on the integrated variational Bayesian tensor decomposition algorithm Extracting information on debonding defects in composite materials.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing and evaluation, and more specifically relates to a high-resolution detection and identification method for debonding defects of composite materials. Background technique [0002] Due to the advantages of high specific strength, large specific modulus, good fatigue resistance, low expansion coefficient and strong designability, carbon fiber reinforced composites (CFRP) have become indispensable and important structural materials in high-tech fields such as aerospace. However, damage is unavoidable in the process of manufacturing, assembly, long-term service, etc. Common internal defects of composite composite structures include delamination, debonding, inclusions, etc. Since the deformation of the internal structure is difficult to detect and causes great damage, With the continuous improvement of processing technology and application requirements of composite materials, higher requ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/62
CPCG06F18/24155
Inventor 高斌冯琪智鲁鹏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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