Unlock instant, AI-driven research and patent intelligence for your innovation.

Cured resin composition and reflection film and printed circuit board employing same

A technology of curable resin and composition, which is applied in the direction of printed circuit, printed circuit, printed circuit parts, etc., can solve the problem that the scratch resistance cannot be said to be sufficient, and achieve high scratch resistance and light reflection Excellent efficiency and diffusivity

Active Publication Date: 2017-07-04
TAIYO INK SUZHOU
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, the inventors conducted experiments on optical properties and scratching with copper on a cured product composed of a conventional curable resin composition. The rubbing property cannot be said to be sufficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cured resin composition and reflection film and printed circuit board employing same
  • Cured resin composition and reflection film and printed circuit board employing same
  • Cured resin composition and reflection film and printed circuit board employing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0151] Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to these.

[0152] [Curable resin composition]

[0153] According to the compounding quantity shown in following Table 1, after mixing and stirring each component, it dispersed and kneaded, and the curable resin composition of Examples 1-10 and Comparative Examples 1-5 was produced. The numbers in the table represent parts by mass.

[0154]

[0155]

[0156] About each curable resin composition obtained in Examples 1-10 and Comparative Examples 1-5, the following various properties were tested and evaluated.

[0157]

[0158] Each composition of Examples 1 to 10 and Comparative Examples 1 to 5 was coated on the entire surface of a 1.6 mm copper-clad FR-4 substrate by screen printing so that the dry film thickness was 20 μm, and dried at 80°C 30 minutes, let cool to room temperature. Then, use a non-contact (Off-cont...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
The average particle sizeaaaaaaaaaa
Film thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a cured resin composition and a reflection film and printed circuit board employing the same. With regard to the cured resin composition, a curing substance is excellent in light reflectivity and diffusion performance and high in scratch resistance. The cured resin composition is characterized by comprising cured resin, titanium oxide, a flaky or plate-shaped first inorganic filling material with mohs hardness being 1-2, preferably, the cured resin composition comprises a second inorganic filling material with mohs hardness being 2-3, and preferably, the cured resin composition comprises silicon dioxide with average grain sizes (D50) under 0.1 micrometers.

Description

technical field [0001] The present invention relates to a curable resin composition, a reflective film and a printed wiring board using the curable resin composition. Background technique [0002] In general, electronic components are arranged at specific positions by soldering on a printed circuit board on which circuit wiring is formed. In addition, on such a printed wiring board, a solder resist film formed by applying and curing a curable resin composition is used as a protective film for a circuit when soldering electronic components. [0003] The solder resist film prevents solder from adhering to unnecessary portions at the time of soldering, and prevents deterioration due to oxygen or moisture due to direct exposure of circuit conductors to air. Furthermore, the solder resist also functions as a permanent protective film of the circuit board. Therefore, various properties such as adhesiveness, electrical insulation, solder heat resistance, solvent resistance, and c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/004H05K1/02
CPCG03F7/004H05K1/0274H05K2201/2054
Inventor 山本修一福田晋一朗许红金
Owner TAIYO INK SUZHOU