Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Breakdown diagnosis method for semiconductor devices

A process equipment and fault diagnosis technology, applied in the field of semiconductor manufacturing, can solve the problems of lack of self-learning correction mechanism and low pattern matching efficiency, achieve good anti-interference ability, improve engineering practicability, and save storage space

Inactive Publication Date: 2017-07-04
SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI +1
View PDF4 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the current expert systems use forward reasoning. When the number of knowledge rules is large, explosive combinations of knowledge are likely to occur, resulting in low pattern matching efficiency. On the other hand, the construction of fuzzy knowledge bases in expert systems mainly depends on experts Experience, in the process of using the fuzzy reasoning system, it also mainly relies on experts to maintain the knowledge base, lacking a self-learning correction mechanism based on reasoning result samples

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Breakdown diagnosis method for semiconductor devices
  • Breakdown diagnosis method for semiconductor devices
  • Breakdown diagnosis method for semiconductor devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0049]The present invention relates to a fault diagnosis method for semiconductor process equipment, and its working steps are as follows: Step 1, construction of parameter fuzzy information; Step 2, establishment of fuzzy rule base; Step 3, fuzzy reasoning based on rete algorithm; Step 4 1. Defuzzify and obtain the fault diagnosis result; step 5, rule strength self-learning correction. Compared with the existing fuzzy reasoning method, the invention enables the expert system to have preliminary self-learning ability by applying the rule strength self-learning correction algorithm, and improves the reasoning efficiency of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a breakdown diagnosis method for semiconductor devices. The method includes the following steps: firstly establishing an expert system which includes a fuzzy rule database and an inference engine; further, conducting fuzzy processing on a semiconductor device real-time monitoring parameter to generate a fuzzy fact; the inference engine, on the basis of the fuzzy fact, performing fuzzy processing by interacting with the fuzzy rule database to generate a breakdown diagnosis result; and on the basis of actual application conditions of the breakdown diagnosis result, carrying out rule intensity self-learning correction targeted at the fuzzy rule database. According to the invention, the method performs fuzzy inference and further obtains the breakdown diagnosis result based on the rete algorithm, and carries out rule intensity self-learning correction on the fuzzy rule database in combination with the actual application of the breakdown diagnosis result, so that the method increases the precision and automation of the breakdown diagnosis for semiconductor devices and ensures efficient and stable operation of the semiconductor technology.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a fault diagnosis method for semiconductor process equipment. Background technique [0002] The operating status of process equipment in semiconductor enterprises has a great impact on the production capacity of the enterprise, and the cost of semiconductor process equipment is extremely expensive. Improving equipment maintenance efficiency and reducing equipment downtime is an important way to improve enterprise production capacity and control production costs. Therefore, it has become an urgent need for semiconductor companies to provide convenient, practical and reliable fault diagnosis for semiconductor process equipment, and the increasingly complex structure of equipment has also brought great challenges to fault diagnosis. Intelligent fault diagnosis technology has opened up a new way for this requirement, and it is of high value to apply intelligent ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06N5/04
CPCG06N5/048G06N5/047
Inventor 于淼廖柯段彬里鹏胡国良
Owner SHENYANG INST OF AUTOMATION - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products