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Production method of epoxy resin board for photo-elastic experimental test

A technology of epoxy resin board and production method, which is applied in the direction of force measurement, measurement force, and measurement device by measuring the change of optical properties of materials when they are stressed, can solve the problems affecting test accuracy, processing difficulties, limitations, etc., Achieve the effect of good transparency, wide application range and improved performance

Inactive Publication Date: 2017-07-07
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Photoelastic materials are the key to photometric experiments, and their performance and quality will directly affect the conduct of the experiment and the accuracy of the test. Moreover, since the shape of the experimental model must be similar to the original structure, it is difficult to process, and there may be machining during the process. stress, so the photoelastic simulation method is subject to some limitations in practical application

Method used

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  • Production method of epoxy resin board for photo-elastic experimental test
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The used glass mold of the present invention sees figure 1 , including two glass plates 1, 2 and a rubber tube 4 pressed between the two glass plates, the rubber tube 4 is U-shaped, and the upper end surface of the U-shaped rubber tube is surrounded by the inner surfaces of the two glass plates. Into the molding space of the epoxy resin board.

[0038] The pretreatment of the glass mold comprises the following steps:

[0039] (a) Cleaning of glass plates and rubber tubes: first scrub with detergent, then rinse with water, and finally wipe with absolute ethanol and acetone in turn. The glass surface is required to be free of dust, grease, clean and transparent, and air-dry naturally;

[0040] (b) Release agent configuration: mix toluene and polystyrene according to the weight ratio of 10:1, fully dissolve, and the dissolution time is 4-5h;

[0041] (c) Film formation on the surface of the glass plate and rubber tube: Soak the glass plate, glass spacer and rubber tube i...

Embodiment 2

[0044] A kind of production method of the epoxy resin plate that is used for photoelastic experiment test, comprises the following steps:

[0045] (1) Heat 517.58g of 6101 epoxy resin to 120°C, keep it warm for 2 hours while stirring, cool down to 60°C naturally after the heat preservation is over, keep it warm, and set aside;

[0046] (2) Put 103.52g of maleic anhydride in a 70°C oil bath until the maleic anhydride melts, set aside;

[0047] (3) 77.64g dibutyl phthalate, 155.27g 304 polyester resin and the maleic anhydride of step (2) are added in the 6101 epoxy resin of step (1), obtain mixed solution;

[0048] (4) Stir the mixed solution of step (3) with an electric stirrer for 30 minutes under the condition of 60° C. oil bath, and then let stand for 2 hours;

[0049] (5) Preheat the glass mold (Example 1) for preparing the epoxy resin plate at 60°C for 40 minutes, then pour the mixed solution of step (4) into the preheated glass mold, and solidify at 42°C 5d, making a mo...

Embodiment 3

[0059] A kind of production method of the epoxy resin plate that is used for photoelastic experiment test, comprises the following steps:

[0060] (1) Heat 449.47g of 6101 epoxy resin to 120°C, keep it warm for 2 hours while stirring, cool down to 60°C naturally after the heat preservation is over, keep it warm, and set aside;

[0061] (2) Put 67.42g of maleic anhydride in a 70°C oil bath until the maleic anhydride melts, set aside;

[0062] (3) 67.42g dibutyl phthalate, 269.68g 304 polyester resin and the maleic anhydride of step (2) are added in the 6101 epoxy resin of step (1), obtain mixed solution;

[0063] (4) Stir the mixed solution of step (3) with an electronic stirrer for 30 minutes under the condition of 60° C. oil bath, and then let stand for 3 hours;

[0064] (5) Preheat the glass mold (Example 1) for preparing the epoxy resin plate at 60°C for 40 minutes, then pour the mixed solution of step (4) into the preheated glass mold, and solidify at 43°C 5d, making a m...

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Abstract

The invention discloses a production method of an epoxy resin plate used for photoelastic experiment testing. The method uses epoxy resin, maleic anhydride, dibutyl phthalate and polyester resin as raw materials. Epoxy resin boards with different properties can be prepared by adjusting the amount of raw materials and optimizing the curing process of the mixed raw materials. The method of the invention is simple, rich in raw materials, easy to produce, high in optical sensitivity, good in transparency, small in time edge effect, and capable of producing novel photoelastic epoxy resins with elastic modulus from 1.29MPa to 57.32MPa and Poisson's ratio from 0.35 to 0.68 It can be used to make structural similar models in mechanical, water conservancy, civil engineering and other engineering, and it is an excellent material for photoelastic experiments of plane stress models.

Description

technical field [0001] The invention relates to photometric experiment materials, in particular to a production method of an epoxy resin plate used for photoelastic experiment testing. Background technique [0002] Photoelasticity method is a relatively mature method in photometry. This method uses materials with special optical properties (such as glass, epoxy resin, etc.) The situation meets the similar conditions. Put the loaded model in the polarized light field to obtain the interference fringe diagram of light. These fringes represent the stress state of the model boundary and internal points. According to the photoelastic principle, each The magnitude and direction of the stress at the point can be converted into the stress in the actual structure according to the similarity principle of the model. In mechanical engineering, hydraulic engineering, civil engineering and other disciplines, the photoelastic method has been widely used. Photoelastic materials are the ke...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L67/00C08K5/12C08G59/42G01L1/24B29C35/02B29C33/38
CPCC08L63/00B29C33/38B29C35/02C08G59/4207G01L1/241C08L67/00C08K5/12
Inventor 刘希亮郭佳奇王建华龚健罗静于建新许来斌
Owner HENAN POLYTECHNIC UNIV
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