Aqueous epoxy resin colloid and preparation method thereof

A technology of water-based epoxy resin and epoxy resin, which is applied in the direction of epoxy resin coating, latex paint, coating, etc., can solve the problems of stability and the size of hydrophilic epoxy resin that cannot fully meet the requirements, and achieve the goal of moistening Good wet performance, low reaction temperature, simple operation

Active Publication Date: 2017-07-14
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] To sum up, the existing epoxy resin can only form an emulsion after water-based, and the stability, hydrophilicity and the size of the epoxy resin in the emulsion cannot fully meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A kind of water-based epoxy colloid, its preparation process is as follows:

[0021] (1) Dilute 200 g of epoxy resin E-44 and 160 g of epoxy reactive diluent AGE until uniform and transparent;

[0022] (2) Control the temperature at 80°C, add 37 g of diethanolamine dropwise, and react at constant temperature for 1-1.5 h;

[0023] (3) Add 17 g of glacial acetic acid while stirring, and react at constant temperature for 30 min;

[0024] (4) Slowly add deionized water dropwise under stirring to dilute to a solid content of 60% to obtain a uniform and transparent water-based epoxy colloid.

Embodiment 2

[0026] A kind of water-based epoxy colloid, its preparation process is as follows:

[0027] (1) Dilute 100 g of epoxy resin E-51 and 100 g of epoxy reactive diluent AGE until uniform and transparent;

[0028] (2) Control the temperature at 85°C, add 22 g of diethanolamine dropwise, and react at constant temperature for 2 h;

[0029] (3) Add 10 g of glacial acetic acid while stirring, and react at constant temperature for 30 min;

[0030] Slowly add deionized water dropwise to dilute to a solid content of 60% under stirring to obtain a uniform and transparent water-based epoxy colloid.

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Abstract

The invention relates to a preparation method of an aqueous epoxy colloid, and belongs to the field of paint industry. The aqueous epoxy resin colloid comprises the following components in percentage by weight: 20 to 30 wt% of epoxy resin, 20 to 30 wt% of epoxy diluent, 5 to 10 wt% of diethanolamine, 1 to 5 wt% of acetic acid, and 30 to 40 wt% of deionized water. The preparation method comprises the following steps: at first, diluting epoxy resin by an active diluent until the epoxy resin becomes uniform and transparent, adding diethanolamine at a controlled temperature of 80 to 85 DEG C, carrying out reactions for 1 to 1.5 hours at a constant temperature, adding acetic acid to carry out neutralization, and dropwise adding deionized water under stirring to obtain transparent and uniform aqueous epoxy colloid. Compared with a conventional chemical modification method, the operation is simple, the reaction temperature is low, the reaction time is short, and nearly no VOC is discharged. The size of colloid particles reaches the nano level. The stability is good, the hydrophilic property is excellent, and the viscosity is low.

Description

technical field [0001] The invention relates to a water-based epoxy resin colloid and a preparation method thereof, belonging to the field of coating chemical industry. Background technique [0002] Epoxy resin refers to a high molecular polymer containing epoxy groups (Epoxy Group, EPG), but some compounds with small molecular weight and containing two or more epoxy groups, because it can Polymerized into plastics, so people customarily call this type of epoxy compound epoxy resin. Epoxy resin coatings are widely used in all aspects of life and play a vital role in coatings. The adhesion between the epoxy resin and the substrate is good, because it contains hydroxyl groups and ether bonds, so it also has good adhesion to the wet surface; there are many types of epoxy resin curing agents, the curing volume shrinkage is only 2%, and it can form after curing. Three-dimensional network structure, with good water resistance, acid and alkali resistance, oil resistance. There a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D5/02C08G59/14
CPCC08G59/1477C09D5/022C09D163/00
Inventor 刘海萍张松毕四富左银成王春雨曹立新
Owner HARBIN INST OF TECH AT WEIHAI
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