UHF RFID label

A tag and tag chip technology, applied in the field of UHFRFID tags, can solve the problems of recession, RFID chip substrate detachment, aluminum easily broken performance, etc., to achieve the effect of improving reliability, reducing mounting process tolerance, and avoiding waste.

Pending Publication Date: 2017-07-18
HANGZHOU CENTURY TECH
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After rubbing the RFID tag with the general aluminum etching process several times, the aluminum on the surface of the tag is easy to break and

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • UHF RFID label
  • UHF RFID label
  • UHF RFID label

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0027] see image 3 The difference between this embodiment and the first embodiment lies in that: the fixed layer is a protective layer 5, and the protective layer 5 covers the substrate 2 and wraps the label chip 3 therein. The protective layer 5 should be tangent to the four corners of the label chip 3 , ie wrap the entire label chip 3 therein. The protective layer 5 is a black glue layer. The black glue has the characteristics of high viscosity, high temperature resistance, solvent resistance, and no glue overflow. It can bond the label chip 3 and the substrate 2 well to ensure that the label chip 3 does not fall off. All the other structures are the same as in Embodiment 1.

[0028] During processing in this embodiment, the embedding method and the installation method of the label chip 3 are the same as in the first embodiment. After the label chip 3 is placed, the protective layer 5 covers the label chip 3 and wraps it and fixes it on the substrate 2. The protective laye...

Embodiment 3

[0030] see Figure 4 The difference between this embodiment and Embodiment 1 is that the fixing layer includes a protective layer 5 and a covering layer 4, and the protective layer 5 is covered on the substrate 2 to wrap the label chip 3 therein, and the covering layer 4 Covering the substrate 2 to wrap the protective layer 5, the label chip 3 and the radio frequency circuit 1 therein. All the other structures are the same as in Embodiment 1.

[0031] During processing in this embodiment, the embedding method and the installation method of the label chip 3 are the same as in the first embodiment. After the label chip 3 is placed, the protective layer 5 covers the label chip 3 and wraps it and fixes it on the substrate 2. The protective layer 5 has a certain mechanical strength and is well bonded to the substrate 2 to ensure that the chip label 3 does not fall off. Further wrap the label chip 3 and the radio frequency circuit 1 with the cover layer 4 and the base material 2, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A UHF RFID label is disclosed and comprises a label chip, a radio frequency circuit and base material, wherein the radio frequency circuit is imbedded on the base material, the label chip is an on board chip, the label chip is placed in an inductance ring of the radio frequency circuit and is coupled to the radio frequency circuit, and a fixing layer used for wrapping the label chip and fixing the same on the base material is arranged on the label chip. According to the UHF RFID label, the radio frequency circuit is imbedded on the base material via wire imbedding technologies, poor consistency of product performance caused by tolerance of surface mounting technologies can be alleviated, the label chip is placed in the radio frequency circuit via a coupled mode in a disconnected manner, man-hours of workers can be prevented from being wasted by conventional lead pin welding technologies, bandwidth of the RFID label is increased, and application reliability of the RFID label in a whole solution can be increased.

Description

technical field [0001] The invention relates to a UHF RFID tag, in particular to a UHF RFID tag produced by a wire embedding process. Background technique [0002] RFID technology is developing rapidly, its application fields are becoming wider and wider, and the structure of products is also diverse. The usual UHF electronic tag, which uses non-contact automatic identification technology, its basic principle is to use the antenna on the electronic tag to receive the electromagnetic wave signal from the reader and the sending tag itself, when the reader scans the UHF electronic tag , to realize the automatic identification of tagged objects. UHF electronic tags are generally composed of a tag antenna and a tag-specific chip. The function of the tag antenna is to send and receive electromagnetic wave signals. Its performance is directly related to the stability and sensitivity of the sending and receiving signals (effective operating distance); the tag chip is equivalent to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06K19/077
CPCG06K19/07745G06K19/07749
Inventor 吴夏冰王俊杰朱爱芬商巍
Owner HANGZHOU CENTURY TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products