UHF RFID label
A tag and tag chip technology, applied in the field of UHFRFID tags, can solve the problems of recession, RFID chip substrate detachment, aluminum easily broken performance, etc., to achieve the effect of improving reliability, reducing mounting process tolerance, and avoiding waste.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 2
[0027] see image 3 The difference between this embodiment and the first embodiment lies in that: the fixed layer is a protective layer 5, and the protective layer 5 covers the substrate 2 and wraps the label chip 3 therein. The protective layer 5 should be tangent to the four corners of the label chip 3 , ie wrap the entire label chip 3 therein. The protective layer 5 is a black glue layer. The black glue has the characteristics of high viscosity, high temperature resistance, solvent resistance, and no glue overflow. It can bond the label chip 3 and the substrate 2 well to ensure that the label chip 3 does not fall off. All the other structures are the same as in Embodiment 1.
[0028] During processing in this embodiment, the embedding method and the installation method of the label chip 3 are the same as in the first embodiment. After the label chip 3 is placed, the protective layer 5 covers the label chip 3 and wraps it and fixes it on the substrate 2. The protective laye...
Embodiment 3
[0030] see Figure 4 The difference between this embodiment and Embodiment 1 is that the fixing layer includes a protective layer 5 and a covering layer 4, and the protective layer 5 is covered on the substrate 2 to wrap the label chip 3 therein, and the covering layer 4 Covering the substrate 2 to wrap the protective layer 5, the label chip 3 and the radio frequency circuit 1 therein. All the other structures are the same as in Embodiment 1.
[0031] During processing in this embodiment, the embedding method and the installation method of the label chip 3 are the same as in the first embodiment. After the label chip 3 is placed, the protective layer 5 covers the label chip 3 and wraps it and fixes it on the substrate 2. The protective layer 5 has a certain mechanical strength and is well bonded to the substrate 2 to ensure that the chip label 3 does not fall off. Further wrap the label chip 3 and the radio frequency circuit 1 with the cover layer 4 and the base material 2, ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com