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Special substrate for FPC boards

A flexible circuit board and base material technology, applied in the field of materials, can solve problems such as cost increase, FPC circuit board short circuit, FPC circuit board production yield reduction, etc., to achieve the effect of improving service life and reducing production costs

Active Publication Date: 2017-07-21
ZHEJIANG OUREN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional release film usually has the following disadvantages: after the release film is torn off, the silicone release agent on the surface of the release film migrates into the copper foil, resulting in a short circuit of the FPC circuit board, which greatly reduces the production yield of the FPC circuit board and reduces the cost. Greatly improve

Method used

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  • Special substrate for FPC boards
  • Special substrate for FPC boards
  • Special substrate for FPC boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Preparation of release agent:

[0026] Weigh the raw materials in the following weight percentages,

[0027]

[0028] Add K100D (Shanghai Jiteng Chemical Co., Ltd.) to toluene, stir, then add dicumyl peroxide, titanic acid coupling agent, and straight-chain alkanes (the number of carbon atoms is 20), and stir for 60-90 minutes, let it sit.

[0029] (2) Preparation of release film layer:

[0030] Put the polyester film on the roller shaft of the adhesive machine and unwind it, the unwinding speed is 35 m / min, dry, coat the release agent on the polyester film, the coating amount is 0.2 g / square meter, pass through In the drying section, the temperature is 80°C, 100°C, 120°C, 150°C, 150°C, 150°C, 120°C, 80°C, cooling, winding, and the winding speed is 35 m / min.

[0031] (3) Preparation of special base materials for FPC flexible circuit boards:

[0032] Coating 10 microns of epoxy resin composite glue layer on the PI film layer surface with a thickness of 25 micr...

Embodiment 2

[0035] (1) Preparation of release agent:

[0036] Weigh the raw materials in the following weight percentages,

[0037]

[0038] Add K100D to butanone, stir, then add benzoyl peroxide, titanic acid coupling agent, and straight-chain alkanes (with 25 carbon atoms) in sequence, stir and react for 60-90 minutes, and let stand.

[0039] (3) Preparation of release film layer:

[0040] Put the polyester film on the roller shaft of the adhesive machine and unwind it, the unwinding speed is 35 m / min, dry, coat the release agent on the polyester film, the coating amount is 0.2 g / square meter, pass through In the drying section, the temperature is 80°C, 100°C, 120°C, 150°C, 150°C, 150°C, 120°C, 80°C, cooling, winding, and the winding speed is 35 m / min.

[0041] (3) Preparation of special base materials for FPC flexible circuit boards:

[0042] Coating 15 microns of epoxy resin composite glue layer on the PI film layer surface with a thickness of 30 microns, then bonding 20 microns...

Embodiment 3

[0045] (1) Preparation of release agent:

[0046] Weigh the raw materials in the following weight percentages,

[0047]

[0048] Add K100D to ethyl acetate, stir, then add benzoyl peroxide, titanic acid coupling agent, and linear alkanes (with 22 carbon atoms) in sequence, stir for 60-90 minutes, and let stand.

[0049] (4) Preparation of release film layer:

[0050] Put the polyester film on the roller shaft of the adhesive machine and unwind it, the unwinding speed is 35 m / min, dry, coat the release agent on the polyester film, the coating amount is 0.2 g / square meter, pass through In the drying section, the temperature is 80°C, 100°C, 120°C, 150°C, 150°C, 150°C, 120°C, 80°C, cooling, winding, and the winding speed is 35 m / min.

[0051] (3) Preparation of special base materials for FPC flexible circuit boards:

[0052] Coating the PI film layer surface with a thickness of 20 microns with an epoxy resin composite glue layer of 8 microns, then bonding a 20 micron copper ...

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Abstract

The invention belongs to the technical field of materials, and particularly relates to a special substrate for FPC (Flexible Printed Circuit) boards. The special substrate sequentially comprises a PI film layer, a composite glue layer, a copper foil layer, and a release film layer. The release film layer is prepared by coating a polyester film layer with release agent. The release agent includes, by weight percentage, 0.5-3% of non-silicone oil release agent, 0.05-0.3% of cross-linking agent, 0.02-0.2% of adhesion additive, 0.05-0.2% of release force regulator, and 96.3-99.38% of solvent. The surface of the outermost layer of the special substrate for FPC boards prepared in the invention is a release film layer which uses a non-silicone oil formulation system. Therefore, in the use process, the silicone oil content in the release film is 0, there is no silicon transfer phenomenon, and short circuit is not caused. The service life of FPC boards is improved, and the cost of production is reduced.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a special substrate for FPC flexible circuit boards. Background technique [0002] Radio frequency identification, RFDI (Radio Frequency Identification) technology, also known as radio frequency identification, is a communication technology that can identify specific targets through radio signals and read and write related data without the need to establish mechanical or optical contact between the identification system and specific targets . [0003] With the rapid development of RFDI technology, its application field has been extended to various fields of people's work and life. The RFDI system consists of three parts: RFDI tags, RFDI readers and application support software. The FPC circuit board used in the RFDI label is generally made by the following process: coating the composite glue on the PI film, and covering it with the non-silicon release film mention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03
CPCH05K1/028H05K1/036H05K2201/0195
Inventor 江叔福杨晓明
Owner ZHEJIANG OUREN NEW MATERIALS CO LTD
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