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Moulded circuit module, and production method therefor

A circuit module and molding technology, which is applied in the direction of circuits, printed circuits, circuit devices, etc., can solve problems such as inability to function and reduce

Inactive Publication Date: 2017-08-01
MEIKO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the technique of using a box as described above, or the technique of forming a shielding layer by coating a paste containing metal powder on the surface of a resin or performing plating is nothing but fabrication on the outside of a circuit module or a molded circuit module. A wall for shielding electromagnetic waves, so if there are electronic components that are mutually affected by electromagnetic waves in one molded circuit module, it cannot function to reduce the mutual influence

Method used

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  • Moulded circuit module, and production method therefor
  • Moulded circuit module, and production method therefor
  • Moulded circuit module, and production method therefor

Examples

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Embodiment Construction

[0092] Hereinafter, a preferred embodiment of the method for manufacturing a molded circuit module according to the present invention will be described with reference to the drawings.

[0093] In this embodiment, a molded circuit module is manufactured using the substrate 100 shown in FIG. 1( a ).

[0094] The substrate 100 may be a very general substrate, and the substrate 100 of this embodiment is also a very general substrate. The substrate 100 includes wiring (not shown). The wiring is a wiring that conducts to an electronic component described later and supplies power to the electronic component, and is a well-known or well-known wiring. Wiring is designed to enable the above functions. The wiring may be provided on the substrate 100 by any method, and may be provided anywhere on the substrate 100 . For example, wiring may be provided on the surface of the substrate 100 by printing. The substrate 100 in this case is generally called a printed wiring board. In additio...

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PUM

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Abstract

The purpose of the present invention is to reduce the reciprocal effect exhibited in cases when electronic components which affect each other as a result of electromagnetic waves are present in one moulded circuit module. This moulded circuit module (M) is provided with a substrate (100) having a plurality of electronic components (200) mounted thereto. One electronic component (200A) is a high-frequency oscillator. A metal partition side wall part (320) is provided to the substrate (100). One surface of the substrate (100) is coated with a first resin (400) such that the electronic components (200) and the side wall part (320) are coated therewith. The first resin (400) is covered by a shield layer (600) made from an electromagnetic-wave-blocking metal. The electronic component (200A) is surrounded by the side wall part (320) and the shield layer (600).

Description

technical field [0001] The present invention relates to molded circuit modules. Background technique [0002] Molded circuit modules are known. [0003] The molded circuit module includes a substrate (for example, a printed circuit board) having wiring, electronic components mounted in conduction with the wiring of the substrate, and a resin covering the substrate and the electronic components. The molded circuit module can protect the electronic components by covering the electronic components with resin, and can also protect the conductive parts of the electronic components and the wiring of the substrate. [0004] As mentioned above, the molded circuit module includes electronic components. In addition, among electronic components, there are components that are weak against electromagnetic waves. In addition, among electronic parts, there are parts that emit electromagnetic waves. [0005] In many cases where molded circuit modules are actually used, the molded circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H01L23/00H01L23/28H01L25/07H01L25/18
CPCH01L21/56H01L24/97H01L2924/1815H01L2924/3025H01L23/3121H01L21/561H01L23/552H05K9/0022H05K1/0218H05K1/0243H05K1/185H05K3/22H05K2201/10075
Inventor 三轮悟
Owner MEIKO ELECTRONICS CO LTD
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