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Thiourea modified cardanol aldehydeamine epoxy curing agent and preparation method thereof

A technology of phenalkamine epoxy and curing agent, applied in the field of curing agent, thiourea modified cardanol phenol amine epoxy curing agent and preparation, can solve the problems of inconvenient construction, high viscosity, etc. Excellent effect of toxicity, low temperature curing performance

Inactive Publication Date: 2017-08-04
江苏三木化工股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are also phenalkamine curing agents prepared by reacting thiourea-modified fatty amines with phenol and formaldehyde, but the viscosity is relatively high, which is inconvenient for construction

Method used

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  • Thiourea modified cardanol aldehydeamine epoxy curing agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 1. A thiourea modified cardanol phenalkamine epoxy curing agent, which comprises the following raw materials: thiourea 76g, diethylenetriamine 103g, cardanol 304g, 37% formaldehyde solution 81g.

[0023] 2, the preparation method of thiourea modified cashew nut phenalkamine epoxy curing agent, it may further comprise the steps:

[0024] (1) Add 103g of diethylenetriamine and 76g of thiourea into the reaction flask, under the protection of nitrogen, mix, heat and stir; heat to 50±5°C, and raise the temperature to 130°C after the thiourea is completely melted ±5°C; reflux reaction for 3 hours, and naturally cooled to room temperature to obtain a low-viscosity, dark yellow thiourea-modified amine;

[0025] (2) Then add cardanol 304g in the reaction flask, mix, heat and stir; then heat up to 50°C, start to add 81g of 37% formaldehyde solution dropwise, control the drop rate of formaldehyde so that the temperature does not exceed 100°C; then heat up to 100°C Continue to kee...

Embodiment 2

[0028] 1, a kind of thiourea modified cardanol phenalkamine epoxy curing agent, it comprises following raw material: thiourea 76g, triethylenetetramine 146g, cardanol 304g, 37% formaldehyde solution 81g.

[0029] 2, the preparation method of thiourea modified cashew nut phenalkamine epoxy curing agent, it may further comprise the steps:

[0030] (1) Add 146g of diethylenetriamine and 76g of thiourea into the reaction flask, mix, heat and stir under the protection of nitrogen; heat to 50±5°C, and raise the temperature to 130±5°C after the thiourea is completely melted, Reflux reaction for 3 hours, and naturally cool to room temperature to obtain a low-viscosity, dark yellow thiourea-modified amine;

[0031] (2) Then add cardanol 304g in the reaction flask, mix, heat and stir; then heat up to 50°C, start to add 81g of 37% formaldehyde solution dropwise, control the drop rate of formaldehyde so that the temperature does not exceed 100°C; then heat up to 100°C Continue to keep wa...

Embodiment 3

[0034] 1, a kind of thiourea modified cardanol phenalkamine epoxy curing agent, it comprises following raw material: thiourea 152g, diethylenetriamine 206g, cardanol 304g, 37% formaldehyde solution 162g.

[0035] 2, the preparation method of thiourea modified cashew nut phenalkamine epoxy curing agent, it may further comprise the steps:

[0036] (1) Add 206g of diethylenetriamine and 152g of thiourea into the reaction flask, and mix, heat and stir under the protection of nitrogen; heat to 50°C, and raise the temperature to 135°C after the thiourea is completely melted; reflux reaction for 3h, Cool naturally to room temperature to obtain low viscosity, dark yellow thiourea modified amine;

[0037] (2) Then add cardanol 304g in the reaction flask, mix, heat and stir; then heat up to 50°C, start to add 162g of 37% formaldehyde solution dropwise, control the drop rate of formaldehyde so that the temperature does not exceed 100°C; then heat up to 105°C Continue to keep warm for 3 ...

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Abstract

The invention discloses a thiourea-modified cardanol phenolic amine epoxy curing agent, which is prepared from thiourea, fatty amine, cardanol and formaldehyde. The present invention screens through a large number of experiments to obtain the best raw material composition and proportion and its optimal preparation process. The present invention firstly modifies the fatty amine through thiourea, and then reacts with cardanol and formaldehyde to generate the cardanol phenolic alkamine curing agent. Due to the presence of long-chain hydrocarbon groups in the molecular structure of cardanol, it can not only improve the flexibility of the cured coating film, but also significantly reduce the viscosity of the curing agent. Due to the introduction of thiourea into the molecule, the low-temperature curing performance of cardanol phenalkamine is significantly improved. improvement. The experimental results show that the cashew phenalkamine curing agent prepared by the preferred raw materials in the present invention is a low viscosity, low toxicity, and excellent curing agent at low temperature. Compared with the prior art, it has achieved very good unexpected technical effects .

Description

technical field [0001] The invention relates to a curing agent, in particular to a low-viscosity, low-toxicity, thiourea-modified cashew phenalkamine epoxy curing agent which can be cured at low temperature and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Epoxy resin has excellent bonding strength and anti-corrosion performance, and has been widely used in many fields. Epoxy resins must be used in conjunction with curing agents to be valuable. The types of curing agents mainly include polyamides, phenalkamines, and acid anhydrides. However, acid anhydrides need high temperature to cure epoxy resins. Polyamides and phenalkamines can generally cure epoxy resins at room temperature, but at low temperatures (below 5°C), they cannot participate in the curing reaction well, and it takes a long time to achieve a certain strength. Long time, long curing time. Thiourea can significantly reduce the curing temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G14/08
CPCC08G59/621C08G14/08
Inventor 李伯平惠正权
Owner 江苏三木化工股份有限公司
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