Semiconductor device, film stack, and manufacturing method thereof
A semiconductor and film stacking technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as compressive stress peeling
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[0019] The following disclosed embodiments provide many different embodiments or examples for implementing different features of the provided object. In order to simplify the embodiments of the present disclosure, specific examples of components and arrangements are described below. These are of course examples only and are not intended to be limiting. For example, in the description below, forming a first feature over or on a second feature can include embodiments in which the first and second features are formed in direct contact, and can also include embodiments in which additional features can be formed An embodiment wherein the first and second features are not in direct contact between the first and second features. In addition, embodiments of the present disclosure may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself determine the relationship between the various embodiments and / or conf...
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