Polyurethane lightweight resin plate curing agent for cutting by diamond wire as well as preparation method and application

Abstract

The invention discloses a polyurethane lightweight resin plate curing agent for cutting by a diamond wire. The polyurethane lightweight resin plate curing agent is prepared from diphenyl-methane-diisocyanate (MDI), polyphenyl polymethylene polyisocyanate and hollow glass microspheres. A preparation method of the polyurethane lightweight resin plate curing agent for cutting by the diamond wire comprises the following steps: putting the diphenyl-methane-diisocyanate and the polyphenyl polymethylene polyisocyanate into a reaction kettle in parts by weight and sufficiently stirring; adding the hollow glass microspheres into the reaction kettle in parts by weight and continually stirring to obtain the polyurethane lightweight resin plate curing agent for cutting by the diamond wire. According to the method disclosed by the invention, the hollow glass microspheres with a proper ratio are added into the MDI to prepare the polyurethane lightweight resin plate curing agent so that the rigidity and strength of a polyurethane resin plate can be improved better; the polyurethane lightweight resin plate prepared from the polyurethane lightweight resin plate curing agent for cutting by the diamond wire is a closed-cell foamed polyurethane lightweight resin plate and has light weight; the distribution of net-shaped structures and the rigidity and strength is more uniform.

Description

technical field [0001] The invention relates to the technical field of solar silicon chip cutting, in particular to a curing agent for a polyurethane light resin board for diamond wire cutting, a preparation method and an application thereof. Background technique [0002] Wafer cutting is an important link in the manufacture of photovoltaic solar cells. At present, most of them use diamond wire cutting technology to cut single crystal silicon rods into single crystal silicon wafers. Before using this technology for cutting, the monocrystalline silicon rods need to be glued to the polyurethane resin plate to fix the position of the silicon rods. At present, the curing agent for foaming polyurethane resin boards uses MDI, which is one of the important raw materials for the production of polyurethane foam products, such as open-cell foaming of sponges, etc. The traditional curing agent does not need to add any fillers, and the obtained There are many pores on the surface of th...

AI Technical Summary

Problems solved by technology

At present, the curing agent for foaming polyurethane resin boards uses MDI, which is one of the important raw materials for the production of polyurethane foam products, such as open-cell foaming of sponges, etc. The traditional curing agent does not need to add any fillers, and the obtained There are many pores on the surface of the plate, and the distribution of hardness and strength is uneven

Images