Ultrasonic fingerprint sensor and manufacturing method thereof

A fingerprint sensor and ultrasonic technology, which is applied in semiconductor/solid-state device manufacturing, acquisition/arrangement of fingerprints/palmprints, instruments, etc., can solve problems such as manufacturing difficulties, poor yield, poor parameter consistency, etc., to reduce manufacturing costs, reduce Difficulty, the effect of improving the yield

Active Publication Date: 2017-08-25
HANGZHOU SILAN MICROELECTRONICS
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the ultrasonic transducer includes a cavity structure under the piezoelectric stack, which is not only difficult to manufacture, but

Method used

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  • Ultrasonic fingerprint sensor and manufacturing method thereof
  • Ultrasonic fingerprint sensor and manufacturing method thereof
  • Ultrasonic fingerprint sensor and manufacturing method thereof

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Embodiment Construction

[0069] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown.

[0070] In the following, many specific details of the present invention are described, such as device structures, materials, dimensions, processing techniques and techniques, for a clearer understanding of the present invention. However, the invention may be practiced without these specific details, as will be understood by those skilled in the art.

[0071] The invention can be embodied in various forms, some examples of which are described below.

[0072] figure 1 A flow chart showing a manufacturing method of an ultrasonic fingerprint sensor according to a first embodiment of the present invention. The method includes forming a stac...

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Abstract

The invention discloses an ultrasonic fingerprint sensor and a manufacturing method thereof. According to the method, a CMOS circuit is formed; an ultrasonic transducer is formed on the CMOS circuit. The manufacturing method of the ultrasonic fingerprint sensor comprises steps that a template layer is formed; a first opening is formed on the template layer; a stop layer is formed on the template layer, and the stop layer covers the template layer in a conformal mode; a sacrificial layer is formed on the stop layer, and the first opening is filled by the sacrificial layer; a mask layer is formed on the stop layer and the sacrificial layer, and the mask layer covers the sacrificial layer; at least one second opening arriving the sacrificial layer is formed on the mask layer; the sacrificial layer is removed through the at least one second opening to form a chamber, and a piezoelectric lamination layer is formed on the mask layer. The method is advantaged in that the template layer and the stop layer are utilized to form the chamber, so reduction of manufacturing cost and improvement of performance of sensors can be realized.

Description

technical field [0001] The present invention relates to a fingerprint sensor, and more particularly, to an ultrasonic fingerprint sensor and a manufacturing method thereof. Background technique [0002] Biometric recognition is a technology used to distinguish different biological characteristics, including fingerprints, palm prints, faces, DNA, voice and other recognition technologies. Fingerprints refer to the uneven lines on the skin on the front of the end of a human finger, and the lines are regularly arranged to form different patterns. Fingerprint identification refers to identification by comparing the detailed feature points of different fingerprints. Due to its lifelong invariance, uniqueness and convenience, the application of fingerprint identification is more and more extensive. [0003] In fingerprint recognition, a sensor is used to obtain fingerprint image information. According to different working principles, fingerprint sensors can be divided into optic...

Claims

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Application Information

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IPC IPC(8): G06K9/00H01L27/20H01L21/82
CPCH01L21/82G06V40/1306H10N39/00
Inventor 季锋闻永祥刘琛周浩
Owner HANGZHOU SILAN MICROELECTRONICS
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