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Low-silver solder containing in, li, zr and la and its preparation method and use

A technology of silver brazing material and application, applied in the field of low-silver brazing material and its preparation, can solve the problems of increasing the production cost of industrial products, being unable to obtain reasonable utilization, increasing silver consumption, etc., achieving easy mass production and convenient processing and preparation , The effect of reducing the brazing temperature

Inactive Publication Date: 2019-08-13
江西金世纪特种焊接材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the amount of silver accounts for one-third. Silver is a precious metal and an important strategic metal of the country. The use of a large amount of high-silver solder not only increases the production cost of industrial products, but also leads to a sharp increase in silver consumption. Resources are inevitably wasted and cannot be used rationally. Therefore, research and development of a phosphorus copper solder with low content, low melting point and good wettability, which can widely replace high-silver solder, has important practical industrial application significance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A kind of low-silver solder containing In, Li, Zr and La, its raw material composition and its weight percent content are: 3% Ag, 6% P, 0.05% In, 0.05% Li, 0.005% Zr, 0.005% La, and the balance is Cu.

[0043] "A low-silver brazing filler metal containing In, Li, Zr and La" obtained by the above-mentioned composition ratio, the melting temperature is 705°C, the tensile strength of the brazing filler metal is 540MPa, and the tensile strength of the brazed copper joint is 255MPa , The shear strength is: 180MPa.

Embodiment 2

[0045] A kind of low-silver solder containing In, Li, Zr and La, its raw material composition and its weight percent content are: 3% Ag, 6.5% P, 0.1% In, 0.1% Li, 0.005% Zr, 0.005% La, and the balance is Cu.

[0046] "A low-silver brazing filler metal containing In, Li, Zr and La" obtained by the above composition ratio, the melting temperature is 695°C, the tensile strength of the brazing filler metal is 545MPa, and the tensile strength of the brazed copper joint is 250MPa , The shear strength is: 185MPa.

Embodiment 3

[0048] A kind of low-silver solder containing In, Li, Zr and La, its raw material composition and its weight percent content are: 3% Ag, 6.5% P, 0.05% In, 0.05% Li, 0.005% Zr, 0.005% La, and the balance is Cu.

[0049] "A low-silver brazing filler metal containing In, Li, Zr and La" obtained by the above composition ratio, the melting temperature is 690°C, the tensile strength of the brazing filler metal is 548MPa, and the tensile strength of the brazed copper joint is 266MPa , The shear strength is: 188MPa.

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Abstract

The invention relates to the metal material and metallurgy field, in particular to low silver brazing and soldering alloy with In, Li, Zr and La and a preparation method and application thereof. The low silver brazing and soldering alloy with In, Li, Zr and La belongs to a medium-temperature soldering and brazing material and comprises, by weight, 3%-5% of Ag, 6%-8% of P, 0.05%-2.5% of In, 0.05%-2.5% of Li, 0.005%-0.1% of Zr, 0.005%-0.1% of La, and the balance Cu. Silver ingot, phosphori, electrolytic copper, metal In, metal Li, metal Zr and rare earth La, which are sold in the market, are used, matching is carried out according to the design composition, conventional intermediate-frequency smelting and pouring are adopted, a wire can be obtained through squeezing and drawing, and a flux-cored colder wire can be obtained by adding brazing flux. The brazing and soldering alloy has the characteristics of low silver content, a low melting point, good wettability and high strength, and can replace BCu75PAg with 20% of silver and BAg25CuZnSn brazing and soldering alloy with 25% of silver, and the BCu75PAg with 20% of silver and the BAg25CuZnSn brazing and soldering alloy with 25% of silver are widely used in the refrigeration industry.

Description

technical field [0001] The invention relates to the field of metal materials and metallurgy, in particular to a low-silver solder containing In, Li, Zr and La, a preparation method and application thereof. Background technique [0002] With the strict restrictions on the use of solder containing harmful element cadmium in industry at home and abroad, especially in the home appliance industry, silver solder with higher silver content has been widely used as an alternative in the industry. With the improvement of living standards, the demand for refrigeration appliances represented by air conditioners and refrigerators is increasing, and the demand for silver brazing materials used in compressors and refrigeration pipelines is also increasing. At present, brazing of dissimilar materials such as copper and copper alloys, copper and Bondi tubes in refrigeration and other industries generally use solders with relatively high silver content, such as: BCu75PAg with 20% silver and B...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/302B23K35/40
Inventor 刘强
Owner 江西金世纪特种焊接材料有限公司
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