Cooling device utilizing micronized boiling efficient heat exchange technology

A cooling device and miniaturization technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of hindering the miniaturization of bubbles and boiling, wall burning, etc., and achieve extremely high working heat load Cooling problems of devices and equipment, convenient processing, and simple structure

Active Publication Date: 2017-09-08
SICHUAN UNIV
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  • Application Information

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Problems solved by technology

Experiments have found that the main reason for hindering the occurrence of bubble miniaturization and boiling on the larger-sized heating surface is that the extremely high heat flux makes the cooling liquid downstream of the heating surface rapidl

Method used

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  • Cooling device utilizing micronized boiling efficient heat exchange technology
  • Cooling device utilizing micronized boiling efficient heat exchange technology
  • Cooling device utilizing micronized boiling efficient heat exchange technology

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Embodiment Construction

[0021] Below in conjunction with accompanying drawing example the present invention is described in more detail: the present embodiment is implemented under the premise of the technical solution of the present invention, has provided detailed implementation scheme and specific operation process, but the protection scope of the present invention is not limited to the following examples.

[0022] see figure 1 , figure 2 , image 3 and Figure 4 , the present invention mainly includes a water inlet chamber 1, an equalizing orifice plate 2, a flow distribution structure 3, a bottom plate 4, a ribbed heat exchange plate 5 and a water outlet chamber 6. The coolant is degassed water as an example. The subcooling degree of the coolant at the inlet of the water inlet chamber 1 is recommended to be in the range of 40-70K, the size of the ribbed heat exchange plate 5 is 20 cm×20 cm, and the heating power at the bottom is 100 kW.

[0023] see figure 2 , heat is introduced into the ...

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Abstract

The invention relates to a cooling device utilizing a micronized boiling efficient heat exchange technology. The cooling device mainly comprises a water inlet chamber, a flow equalizing pore plate, a flow dividing structure, a bottom plate, a ribbed heat exchange plate and a water outlet chamber, bubble micronized boiling is a special boiling phenomenon which occurs on a small-size heating surface and has a heat exchange ability which is far higher than that of single-phase heat exchange and conventional boiling heat exchange, wherein the heat flow density can each up to 1MW/M<2>. According to the invention, a heat exchange channel with multiple inlets and multiple outlets is formed through combining the flow dividing structure and the ribbed heat exchange plate so as to realize occurrence of bubble micronized boiling on a large-scale heating surface. Pressure fluctuation introduced by bubble breakage in bubble micronized boiling is reduced by using fine needles welded on the flow dividing structure. The cooling device has an extremely high cooling ability and relatively simple in structure, and can solve a cooling problem, which is difficult to be processed by conventional cooling devices, of devices and equipment with a high operating heat load.

Description

technical field [0001] The invention relates to a cooling device that can be applied to cooling such as new-type electric vehicle inverters, laser steering devices, and extremely high-heating devices and equipment in electronic power systems, especially a cooling device that utilizes the miniaturized boiling phenomenon of bubbles to be used for extremely high-heat Cooling device for devices with load and large heating surface and equipment for heat dissipation. Background technique [0002] In many industrial fields such as energy, power and aerospace, with the development of science and technology, more and more engineering systems and devices generate heat that exceeds the limit of the cooling capacity of conventional cooling methods. For example, the current inverter used in new pure electric vehicles or hybrid vehicles, the heating power of its heat dissipation surface can reach more than 100 kW in the size of 20 cm × 20 cm (the heat flux exceeds 250 W / cm2); and the in...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20936
Inventor 唐继国孙立成莫征宇刘洪涛鲍静静谢果
Owner SICHUAN UNIV
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