Cooling device utilizing micronized boiling efficient heat exchange technology

Abstract

The invention relates to a cooling device utilizing a micronized boiling efficient heat exchange technology. The cooling device mainly comprises a water inlet chamber, a flow equalizing pore plate, a flow dividing structure, a bottom plate, a ribbed heat exchange plate and a water outlet chamber, bubble micronized boiling is a special boiling phenomenon which occurs on a small-size heating surface and has a heat exchange ability which is far higher than that of single-phase heat exchange and conventional boiling heat exchange, wherein the heat flow density can each up to 1MW / M<2>. According to the invention, a heat exchange channel with multiple inlets and multiple outlets is formed through combining the flow dividing structure and the ribbed heat exchange plate so as to realize occurrence of bubble micronized boiling on a large-scale heating surface. Pressure fluctuation introduced by bubble breakage in bubble micronized boiling is reduced by using fine needles welded on the flow dividing structure. The cooling device has an extremely high cooling ability and relatively simple in structure, and can solve a cooling problem, which is difficult to be processed by conventional cooling devices, of devices and equipment with a high operating heat load.

Description

technical field [0001] The invention relates to a cooling device that can be applied to cooling such as new-type electric vehicle inverters, laser steering devices, and extremely high-heating devices and equipment in electronic power systems, especially a cooling device that utilizes the miniaturized boiling phenomenon of bubbles to be used for extremely high-heat Cooling device for devices with load and large heating surface and equipment for heat dissipation. Background technique [0002] In many industrial fields such as energy, power and aerospace, with the development of science and technology, more and more engineering systems and devices generate heat that exceeds the limit of the cooling capacity of conventional cooling methods. For example, the current inverter used in new pure electric vehicles or hybrid vehicles, the heating power of its heat dissipation surface can reach more than 100 kW in the size of 20 cm × 20 cm (the heat flux exceeds 250 W / cm2); and the in...

AI Technical Summary

Problems solved by technology

Experiments have found that the main reason for hindering the occurrence of bubble miniaturization and boiling on the larger-sized heating surface is that the extremely high heat flux makes the cooling liquid downstream of the heating surface rapidly heated, making its coldness lower than the supercooling required for bubble miniaturization and boiling. temperature, resulting in the rapid evaporation of the downstream area of ​​the heating surface, and finally the entire wall surface is burned

Images