Stacked package structure and manufacturing method
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of thick stacking packaging structure, high manufacturing cost, complex process, etc., and achieves reduced thickness and reduced processing. Cost, effect of simplifying manufacturing process
Inactive Publication Date: 2017-09-12
SHUNSIN TECH (ZHONG SHAN) LTD
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The invention discloses a stacked package structure and a manufacturing method. The stacked package structure includes a first package and a second package. The first package includes a substrate, a first component mounted on the substrate, a first glue injection body covering the first component, and a first package line. The second package comprises a second component, and a second glue injection body covering the second component. The second package is attached to the first package by the engagement of the second glue injection body with the first glue injection body. The first package line and the second component are electrically connected via a conductive fill hole provided on the first glue injection body and / or the second glue injection body. The present invention discloses the stacked package structure and the manufacturing method thereof, which are designed to reduce the thickness of the stacked packaging structure, simplify the manufacturing process and reduce the processing cost.
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