Stacked package structure and manufacturing method

[0055] Embodiment one

[0056] refer to figure 1 As shown, it is a structural schematic diagram of a preferred embodiment of the package-on-package structure of the present invention.

[0057] The package-on-package structure of this embodiment includes a first package 1 and a second package 2 stacked on the first package 1, wherein:

[0058] The first package body 1 includes a substrate 1b, and the substrate 1b has two opposite sides. A first component is mounted on one side of the substrate 1b and a first pad 1g is provided, and the first component is electrically connected to the first pad 1g through a first package circuit 1e. In a specific implementation, the first component may be a first chip 1c. The other surface of the substrate 1b is provided with first solder balls 1a for electrical connection with external components. The first package body 1 further includes a first glue injection body 1d covering the first component, the first solder pad 1g and the first package circuit 1e.

[0059] The second package 2 includes a second component and a second glue 2b covering the second component. In this embodiment, the second component may be a second chip 2c.

[0060] The second package body 2 is attached to the first package body 1 through the bonding of the second glue body 2b and the first glue body 1d, and the first package circuit 1e and the second components pass through the first glue body 1d. The conductive filling holes 1f are electrically connected.

[0061] Specifically, the second bonding pad 2d is provided at the position where the second bonding body 2b is connected with the first bonding body 1d, and the second component is electrically connected to the second bonding pad 2d through the second solder ball 2a. The filling hole 1f is electrically connected between the first pad 1g and the second pad 2d, so as to electrically connect the first package 1 and the second package 2 . It can be understood that the function of the above-mentioned conductive filling hole 1f is to electrically connect the first package body 1 and the second package body 2, therefore, one end of the conductive filling hole 1f can be connected to any conductor of the first package body 1 (such as the first package body The circuit 1e, the first welding pad 1g, and the first component 1c) are connected and conducted. Similarly, the other end of the conductive filling hole 1f can be connected to any conductor of the second package body 2 (such as the second welding pad 2d, the second component The device 2c) is connected and conducted, and is not limited to be connected between the first pad 1g and the second pad 2d.

[0062] The conductive filling hole 1f includes a through hole and a conductive substance disposed in the through hole. The conductive substance can be a conductive paste filled in the through hole or a conductive film plated on the inner wall of the through hole.

[0063]In this embodiment, the stacked package structure only needs to have a substrate on the first package 1, and the second package 2 can use its own second glue 2b to bond with the first glue 1d of the first package 1 itself. Therefore, it is directly stacked on the first package body 1, the first glue injection body 1d and the second glue injection body 2b are necessary packaging structures for the corresponding package body, and the substrate and soldering parts for separate packaging can be omitted, thereby reducing the stacking At the same time, when the first package body 1 and the second package body 2 are produced, the stacking can be completed simultaneously, which reduces the process, thereby simplifying the manufacturing process and reducing the processing cost.

[0064] Embodiment two

[0065] refer to figure 2 As shown, it is a structural schematic diagram of another preferred embodiment of the package-on-package structure of the present invention.

[0066] The package-on-package structure of this embodiment includes a first package body 1 and a third package body 3 stacked on the first package body 1, wherein

[0067] The structure of the first package body 1 is the same as that in the first embodiment, and will not be repeated here.

[0068] The third package body 3 includes a passive device, a third chip 3c, a second package circuit 3b electrically connecting the passive device and the third chip 3c, covering the passive device, the third chip 3c and the second package circuit 3b The third injection colloid 3d.

[0069] The third package 3 is attached to the first package 1 through the joint of the third glue 3d and the first glue 1d, and the first package circuit 1e and the second package circuit 3b are arranged on the first package 1d. The conductive filling hole 1f is electrically connected. Specifically, a third bonding pad is provided at the position where the third bonding body 3d is bonded to the first bonding body 1d, the above-mentioned passive components are welded to the third bonding pad, and the third chip 3c is bonded to the first bonding body 1d , the passive device and the third chip 3c are electrically connected through connecting wires, and are connected to the second package circuit 3b, and the conductive filling hole 1f is electrically connected between the first pad and the third pad, so that the first package The body 1 and the third package body 3 are electrically connected. It should also be noted that one end of the conductive filling hole 1f can be connected to any conductor of the first package 1, and the other end can be connected to any conductor of the third package 3 (such as the third pad, passive device, the first The three chips 3c) are connected and conducted, and are not limited to being connected between the first pad 1g and the third pad.

[0070] The stacked package structure provided in this embodiment is applicable to stacking packages with different structures, and only needs to make adaptive adjustments to the electrical connection structure according to specific requirements to make the packages conductively connected. In addition, the solution of this embodiment also has the advantages of reducing the thickness of the package-on-package structure, simplifying the manufacturing process, and reducing the processing cost, which is the same as the first embodiment, and will not be analyzed here.

[0071] Embodiment Three

[0072] refer to image 3 As shown, it is a structural schematic diagram of another preferred embodiment of the package-on-package structure of the present invention.

[0073] The package-on-package structure of this embodiment includes a first package 1 , a third package 3 stacked on the first package 1 , and a second package 2 stacked on the third package 3 . The structures of the first package body 1 , the second package body 2 , and the third package body 3 are the same as those in the first and second embodiments. The third package body 3 is stacked on the first package body 1 in the same manner as in the second embodiment. The second package body 2 is stacked on the third package body 3 through the bonding of the second glue body 2b and the third glue body 3d.

[0074] It can be understood that, in specific implementation, more layers of stacking and packaging can be performed with reference to the stacking manner of Embodiment 3 according to actual needs.

[0075] Based on the above-mentioned embodiments, it can be seen that the package-on-package structure disclosed in the present invention only needs to provide a substrate on the first package 1, and the second package 2 or more third packages 3 stacked on the first package It can be directly bonded to the package body adjacent to it, and the substrate and soldering parts for separate package can be omitted, thereby reducing the thickness of the stacked package structure, simplifying the manufacturing process and reducing the processing cost.

[0076] The present invention also discloses a method for manufacturing a package-on-package structure, which will now be described in detail in conjunction with the package-on-package structure in Embodiment 2. refer to Figure 4 As shown, the manufacturing method of the package-on-package structure includes steps:

[0077] S1. Please also refer to Figure 4 and Figure 5 , providing a substrate 1b, installing a first component (such as a first chip 1c) on the substrate 1b, and injecting glue to form a first glue injection body 1d covering the first component; in specific implementation, it is also included in the The step of setting the first welding pad 1g on the substrate, the first component is installed on the substrate 1b through the first welding pad 1g;

[0078] S2. Please also refer to Figure 4 and Image 6 , opening a through hole h at a predetermined position of the first injection body 1d;

[0079] S3, see Figure 4 and Figure 7 Filling the conductive substance in the through hole h to form a conductive filling hole 1f, the conductive substance can be a conductive paste filled in the through hole h or a conductive film plated on the inner wall of the through hole h, and the first glue injection body 1d Etching and electroplating to form the first packaging line 1e connecting the first component and the conductive filling hole;

[0080] S4. Please also refer to Figure 4 and Figure 8 , install the second component on the first glue injection body 1d, specifically, form a second pad 2d connected to the conductive filling hole on the first glue injection body 1d, and place the second component Install and fix through the second pad 2d; electrically connect the second component to the conductive filling hole 1f, and inject glue to form a second glue injection body 2b covering the second component;

[0081] S5. Please also refer to Figure 4 and Figure 9 , forming a first solder ball 1a on the substrate through a ball planting process for electrically connecting with external components.

[0082] In the manufacturing method of the stacked packaging structure disclosed in this embodiment, the packaging structure necessary for the package is used, such as the bonding of the first glue injection 1d and the second glue injection 2b to complete the stacking, the first glue injection 1d, the second glue injection 2b Both are necessary packaging structures for their corresponding packages, which can omit the substrate and welding parts for individual packaging, thereby reducing the thickness of the stacked packaging structure, and can simultaneously complete the stacking while manufacturing the package, reducing the process, thereby The manufacturing process is simplified and the processing cost is reduced.