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Resistance welding automatic developing production system for circuit boards

A production system and circuit board technology, applied in the field of circuit board processing, can solve the problems of poor process consistency, overall unsmooth, low efficiency, etc., and achieve the effect of high degree of automation

Pending Publication Date: 2017-09-15
信丰迅捷兴电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional manual developing equipment has high requirements for workers' skills and experience, and there are disadvantages such as poor process consistency and low efficiency in the actual use process
In the existing development production line, the overall development, washing and drying are not smooth, and the development tank cannot be stirred and the development environment cannot be precisely controlled. After passing through the drying chamber, some impurities are likely to remain on the substrate, resulting in subsequent manufacturing lines. board is defective
In addition, the circuit board development process is prone to produce a lot of development wastewater. If the development wastewater is discharged without proper treatment, it will inevitably pollute the ecological environment and endanger human health.

Method used

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  • Resistance welding automatic developing production system for circuit boards
  • Resistance welding automatic developing production system for circuit boards
  • Resistance welding automatic developing production system for circuit boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] refer to Figure 1 to Figure 3 , an automatic development production system for circuit board solder resistance, including a system frame, a conveying mechanism 1, and a developing spray mechanism 2, an air blowing mechanism 3, and a water washing mechanism 4 arranged horizontally in sequence directly above the conveying mechanism 1 and drying mechanism 5,

[0035] The conveying mechanism 1 passes through the system frame and is arranged between the two side walls of the system frame; the developing spray mechanism 2 includes a lifting platform 203, a lifting motor and a spraying assembly, and the lifting motor is fixedly arranged on On the side wall of the system frame, the lifting platform 203 is movably connected between the side walls in the system frame, the lifting platform 203 is connected to the motor shaft of the lifting motor, and the spray assembly is arranged on the lifting platform 203. The spray assembly is connected to the development tank 6 located at t...

Embodiment 2

[0039] refer to Figure 1 to Figure 3 , an automatic development production system for circuit board solder resistance, including a system frame, a conveying mechanism 1, and a developing spray mechanism 2, an air blowing mechanism 3, and a water washing mechanism 4 arranged horizontally in sequence directly above the conveying mechanism 1 and drying mechanism 5,

[0040] The conveying mechanism 1 passes through the system frame and is arranged between the two side walls of the system frame; the developing spray mechanism 2 includes a lifting platform 203, a lifting motor and a spraying assembly, and the lifting motor is fixedly arranged on On the side wall of the system frame, the lifting platform 203 is movably connected between the side walls in the system frame, the lifting platform 203 is connected to the motor shaft of the lifting motor, and the spray assembly is arranged on the lifting platform 203. The spray assembly is connected to the developing tank 6 located at th...

Embodiment 3

[0046] This embodiment is improved on the basis of the second embodiment. refer to figure 1 and figure 2 , In this preferred embodiment, a filter 9 is provided at the connection between the liquid delivery pipeline and the developing tank 6 . A stirring blade is arranged in the developing tank 6, and the stirring blade is connected to a stirring motor 10 on the outer wall of the developing tank 6, and a heater is also arranged in the developing tank 6. Each shower head 201 in the shower assembly is connected with a pressure controller. By adding stirring blades, the uniformity of the developer can be improved; by adding a heater, the temperature of the developer can be controlled.

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Abstract

The invention discloses a resistance welding automatic developing production system for circuit boards. The resistance welding automatic developing production system comprises a system framework, a conveying mechanism, a developing spraying mechanism, a blowing mechanism, a washing mechanism and a drying mechanism. The developing spraying mechanism comprises a lifting platform, lifting motors and spraying assemblies, the blowing mechanism, the washing mechanism and the drying mechanism are fixedly arranged on the inner side walls of the system framework via connecting plates, a developing solution recycling groove is further formed in the top edge of a developing trough, and a waste liquid recycling groove is further formed in the lower portion of the conveying mechanism. The resistance welding automatic developing production system for the circuit boards has the advantages that the resistance welding automatic developing production system is high in automation degree and is provided with the developing spraying mechanism, the washing mechanism and the drying mechanism, and accordingly developing, washing and drying integrated work can be implemented; the resistance welding automatic developing production system is provided with the blowing mechanism, the developing solution recycling groove and the waste liquid recycling groove, accordingly, developing solution can be classified and recycled, energy can be saved, and environments can be protected.

Description

technical field [0001] The invention relates to circuit board production and processing equipment, in particular to an automatic development production system for circuit board solder resistance, which belongs to the technical field of circuit board processing. Background technique [0002] Driven by the rapid development of industries such as mobile phones, computers, home appliances, and automotive electronics, the domestic PCB industry has ushered in a golden age of rapid development. At present, the production process of circuit boards is generally: pretreatment → lamination → exposure → development → etching → film removal, so as to finally obtain circuit boards. In the PCB board manufacturing process, development is an extremely critical process. [0003] Development is to use a weak alkaline solution to react with the unexposed active groups on the photosensitive film to form soluble substances and dissolve them; is saved to obtain the required line graphics. The t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/30
CPCG03F7/30
Inventor 杜林峰阳英周爱明
Owner 信丰迅捷兴电路科技有限公司
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