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Power conversion apparatus and method for manufacturing the same

A technology of power conversion device and conductive layer, which is applied in the direction of output power conversion device, printed circuit manufacturing, AC motor control, etc., and can solve the problems of IGBT diode damage and destruction

Inactive Publication Date: 2017-10-10
KEIHIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In Patent Document 1, since the bonding ribbon (70) is directly bonded to the IGBT (10) and the diode (20), it is possible that the IGBT (10) or the diode (20) may be damaged due to vibration or pressure of the tool (80). (20) damage or destruction

Method used

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  • Power conversion apparatus and method for manufacturing the same
  • Power conversion apparatus and method for manufacturing the same
  • Power conversion apparatus and method for manufacturing the same

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Experimental program
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Embodiment

[0061] The power conversion device 10 of the present invention is disposed between the battery and the motor. Since the battery and the motor are known, illustration is omitted. In the case of using a motor as a generator, the generated electricity is stored in a battery. Therefore, the power conversion device 10 of the present invention can be arranged between the battery and the motor or between the generator and the battery.

[0062] Such as figure 1 As shown in (a), the power conversion device 10 includes, for example, a capacitor 14 built in a case composed of a lower case 11, an intermediate case 12, and an upper cover 13; and a motor-side bus bar 15. Connected with the motor; and the power module shell 17, which has a built-in power module.

[0063] Such as figure 1 As shown in (b), the power module case 17 has a circuit board 18 for controlling the power module on the upper surface, a cooler 19 for cooling the power module on the lower surface, and semiconductor el...

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PUM

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Abstract

The invention discloses a power conversion apparatus and a method for manufacturing the same. A second lead frame 35 is set onto a conductive layer 26 and a busbar 23. The second lead frame 35 has holes previously formed at opposite ends thereof, and pieces of solder material 36,37 or solder pieces are inserted into the holes. Then, the solder pieces36,37 are vibrated by an ultrasonically vibrating tool, whereby the solder pieces 36,37 are melted without having a high temperature. The second lead frame is thus 35 bonded to the conductive layer and the busbar. A semiconductor element and the busbar are connected by a first lead frame 31 and the second lead framec35. The connection structure thereof is such that the second lead frame 35 to be bonded by ultrasonic bonding or other bonding methods is not directly in contact with the semiconductor element 22, which eliminates the risk of damage to the semiconductor element 22.

Description

technical field [0001] The present invention relates to a power conversion device and a method of manufacturing the power conversion device for converting DC power stored in a battery into AC and supplying it to a motor. Background technique [0002] An inverter device mounted on a hybrid vehicle or an electric vehicle internally includes a power module as a power converter that performs DC-AC power conversion. In this power module, semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors) as switching elements and diodes are electrically connected to bus bars via bonding wires or bonding ribbons as wiring. Various electrical connection structures used at this time are known (for example, refer to Patent Document 1 ( figure 1 , image 3 )). [0003] As in Patent Document 1 figure 1 As shown, the bonding ribbon (70) is stretched over the IGBT (10) (numbers in parentheses indicate the reference numbers described in Patent Document 1. The same applies below)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L21/60H02M7/00
CPCH01L24/49H01L25/07H02M7/003H01L2224/491H05K1/0306H05K1/053H01L2924/19107H05K2201/1053H01L23/49811H01L23/053H01L23/3735H05K2201/10166H05K2201/10174H01L24/40H01L2224/40227H01L2224/40499H01L2224/40095H01L2224/84815H01L2224/85815H01L2224/48095H01L2224/48227H01L2224/48499H01L2224/45014H01L24/48H01L24/84H01L24/85H01L2224/848H01L2224/858H01L24/45H01L2224/85186H01L2224/85181H01L2224/85205H01L2224/40475H01L2224/48476H01L2224/48491H01L2224/40491H01L2224/37011H01L2224/84801H01L2224/84205H01L2224/84181H01L2224/84186H01L24/37H01L2224/37013H01L2224/41174H01L24/41H01L2924/00014H01L2924/014H01L2924/00012H01L2224/45099H01L2224/73221H01L2224/40H01L21/4825H01L21/4853H01L23/49541H01L23/49568H01L24/32H01L24/83H01L2224/32245H01L2224/83815H01L2924/1203H01L2924/13055H01L2924/1425H01L2924/37001H02M7/537H02P27/06H05K1/181H05K3/341
Inventor 石井隆斋藤慎哉
Owner KEIHIN CORP