Die taking and die bonding device and die bonding machine employing same

Abstract

The invention discloses a die taking and die bonding device. A die bonding table moves along an X direction and a Y direction, a planar jig seat is embedded onto the die bonding table and is flush with the die bonding table, a heating device is connected with the planar jig seat, a rotation arm is provided with a welding head, the welding head is used for die taking and die bonding, a substrate is arranged above the die bonding table and does feeding motion relative to the die bonding table along the X direction, a first driving device is used for driving the rotation arm to do circumferential rotation, a wafer table is used for fixing a wafer, and a wafer table driving device is used for driving the wafer table to move along the X direction and the Y direction and driving the wafer table to rotate around a rotation shaft. The die taking and die bonding device has the beneficial effects that the planar jig seat is arranged, the substrate is heated within a certain range, the temperature is stably controlled, and a hole phenomenon is difficult to generate during chip assembly; and during die bonding, a force between the welding head and the substrate is concentrated on the planar jig seat, the requirement on integral smoothness of the die bonding table is greatly reduced, the parallelism of the welding head and the substrate arranged at a chip assembly position is improved, and the surface-mount smoothness of a semiconductor device is ensured.

Description

technical field [0001] The invention relates to the field of crystal-bonding machines, in particular to a crystal-taking and crystal-bonding device and a crystal-bonding machine using the same. Background technique [0002] Die bonding is an extremely important link in the packaging process of semiconductor devices such as ICs. The process of die bonding is as follows: first, the dispensing mechanism (also known as the dispensing module) dispenses glue on the die bonding station of the substrate, and then the semiconductor chip is removed from the wafer by the die bonding swing arm of the die bonding mechanism, and then transferred Go to the crystal bonding station where the glue has been dispensed. Under the same die-bonding yield (quality) conditions, the die-bonding efficiency of the die-bonding machine is an important indicator for evaluating the performance of the die-bonding machine. [0003] For chips with a DAF film on the back, the package size is the same as the ...

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Problems solved by technology

[0003] For chips with a DAF film on the back, the package size is the same as the chip size, and heating is required during packaging, and the temperature tolerance during heating is ±3 degrees. Currently, the conveying channel of the substrate is long, and the entire material channel is The temperature control technology is difficult, and the energy consumption is high, and the temperature control is uneven, which leads to the void phenomenon when the chip is packaged

[0004] On the other hand, since it is difficult to ensure the level of the soldering head and the entire substrate, it is difficult to meet the requirements of high mounting flatness products

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